发明授权
- 专利标题： Adhesive thermal interface and method of making the same
- 专利标题（中）： 粘合剂热界面及其制造方法
-
申请号： US760468申请日： 1996-12-05
-
公开(公告)号： US5904796A公开(公告)日： 1999-05-18
- 发明人: Raymond G. Freuler , Gary E. Flynn
- 申请人： Raymond G. Freuler , Gary E. Flynn
- 申请人地址： CA Laguna Hills
- 专利权人： Power Devices, Inc.
- 当前专利权人： Power Devices, Inc.
- 当前专利权人地址： CA Laguna Hills
- 主分类号： B32B7/06
- IPC分类号： B32B7/06 ; C09K5/08 ; H01L23/373 ; B32B31/00
摘要：
A thermal interface facilitates heat transfer from an electronic component to a heat sink. The thermal interface has a generally planar substrate formed of a heat resistant material having a layer of adhesive formed upon one surface thereof. A layer of conformable, heat conducting material is formed upon the other surface of the substrate. The other layer of adhesive facilitates attachment of the thermal interface to either an electronic component or a heat sink, as desired. The layer of conformable heat conducting material deforms so as to enhance heat transfer from the electronic component to the heat sink.
公开/授权文献
- US4592186A Heavy duty anchor for deck boards and the like 公开/授权日：1986-06-03
信息查询
