发明授权
- 专利标题： Flip chip metallization
- 专利标题（中）： 倒装芯片金属化
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申请号： US825923申请日： 1997-04-02
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公开(公告)号： US5904859A公开(公告)日： 1999-05-18
- 发明人: Yinon Degani
- 申请人： Yinon Degani
- 申请人地址： NJ Murray Hill
- 专利权人： Lucent Technologies Inc.
- 当前专利权人： Lucent Technologies Inc.
- 当前专利权人地址： NJ Murray Hill
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/485 ; H05K3/06 ; H01B13/00
摘要：
The specification describes techniques for applying under bump metallization (UBM) for solder bump interconnections on interconnection substrates. The UBM of the invention comprises a Cu, Cu/Cr, Cr multilayer structure. Problems in etching the Cu/Cr layer are overcome using a high pH etchant containing a copper complexing ingredient to prevent passivation of the copper constituent by the chromium etchant solution. With the availability of this etchant the UBM multilayer can be formed using subtractive techniques.
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