发明授权
- 专利标题： Polishing system for polishing wafer
- 专利标题（中）： 抛光晶圆抛光系统
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申请号： US838636申请日： 1997-04-11
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公开(公告)号： US5908347A公开(公告)日： 1999-06-01
- 发明人: Makoto Nakajima , Yoshio Nakamura , Yasuhide Denda , Toshihisa Yanagisawa , Toshiaki Seki , Satoru Arakawa , Masahiro Takeuchi , Mitsue Ogawa , Masanori Fukushima
- 申请人： Makoto Nakajima , Yoshio Nakamura , Yasuhide Denda , Toshihisa Yanagisawa , Toshiaki Seki , Satoru Arakawa , Masahiro Takeuchi , Mitsue Ogawa , Masanori Fukushima
- 申请人地址： JPX Nagano-ken
- 专利权人： Fujikoshi Kikai Kogyo Kabushiki Kaisha
- 当前专利权人： Fujikoshi Kikai Kogyo Kabushiki Kaisha
- 当前专利权人地址： JPX Nagano-ken
- 优先权： JPX8-100800 19960423
- 主分类号： B23Q41/04
- IPC分类号： B23Q41/04 ; B24B37/00 ; B24B37/04 ; B24B49/00
摘要：
In the polishing system of the present invention, a adhering unit adheres a wafer on a carrying plate using liquid. A polishing unit polishes the wafer using a polishing plate. A feeding unit conveys the carrying plate from the adhering unit to the polishing unit. A dismounting unit removes the wafer from the carrying plate. A first discharging unit conveys the carrying plate from the polishing unit to the dismounting unit. A cleaning unit cleans the vacant carrying plate. A second discharging unit conveys the carrying plate from the dismounting unit to the cleaning unit. A third discharging unit conveys the carrying plate from the cleaning unit to the adhering unit. The units are formed into a loop lines so that the carrying plate is circulated in the loop line and the wafers are polished therein.