公开(公告)号：US5908347A

公开(公告)日：1999-06-01

申请号：US838636

申请日：1997-04-11

申请人： Makoto Nakajima ,  Yoshio Nakamura ,  Yasuhide Denda ,  Toshihisa Yanagisawa ,  Toshiaki Seki ,  Satoru Arakawa ,  Masahiro Takeuchi ,  Mitsue Ogawa ,  Masanori Fukushima

发明人： Makoto Nakajima ,  Yoshio Nakamura ,  Yasuhide Denda ,  Toshihisa Yanagisawa ,  Toshiaki Seki ,  Satoru Arakawa ,  Masahiro Takeuchi ,  Mitsue Ogawa ,  Masanori Fukushima

IPC分类号： B23Q41/04 ,  B24B37/00 ,  B24B37/04 ,  B24B49/00

CPC分类号： B24B37/345 ,  B23Q41/04

摘要： In the polishing system of the present invention, a adhering unit adheres a wafer on a carrying plate using liquid. A polishing unit polishes the wafer using a polishing plate. A feeding unit conveys the carrying plate from the adhering unit to the polishing unit. A dismounting unit removes the wafer from the carrying plate. A first discharging unit conveys the carrying plate from the polishing unit to the dismounting unit. A cleaning unit cleans the vacant carrying plate. A second discharging unit conveys the carrying plate from the dismounting unit to the cleaning unit. A third discharging unit conveys the carrying plate from the cleaning unit to the adhering unit. The units are formed into a loop lines so that the carrying plate is circulated in the loop line and the wafers are polished therein.

摘要翻译： 在本发明的抛光系统中，粘合单元使用液体将晶片粘附在承载板上。 抛光单元使用抛光板抛光晶片。 馈送单元将承载板从粘合单元传送到抛光单元。 拆卸单元从承载板上取下晶片。 第一排放单元将承载板从抛光单元传送到拆卸单元。 清洁单元清洁空载板。 第二排放单元将搬运单元从拆卸单元传送到清洁单元。 第三排放单元将承载板从清洁单元传送到粘附单元。 这些单元形成为环线，使得承载板在环线中循环并且晶片在其中被抛光。

公开(公告)号：US06367529B1

公开(公告)日：2002-04-09

申请号：US09299448

申请日：1999-04-26

申请人： Toshihisa Yanagisawa

发明人： Toshihisa Yanagisawa

IPC分类号： G05G1502

CPC分类号： B24B37/30 ,  B24B41/068 ,  H01L21/681 ,  Y10T156/1092 ,  Y10T156/1754

摘要： The method and the device of the present invention are capable of uniformly using whole surface of a carrying plate, improving the polishing accuracy of wafers and extending span of life of the carrying plate. The method of adhering a plurality of wafers onto a surface of a carrying plate with predetermined spaces is characterized by regularly shifting wafer adhering positions, at which the wafers are respectively adhered, with respect to a standard position of the carrying plate, in the surface of the carrying plate. The wafer adhering position is regularly shifted when the carrying plate is exchanged or predetermined time elapses.