Invention Grant
- Patent Title: Molding multi-layered articles using coinjection techniques
- Patent Title (中): 使用共注射技术成型多层物品
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Application No.: US832893Application Date: 1997-04-07
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Publication No.: US5922363APublication Date: 1999-07-13
- Inventor: Martin H. Beck , George F. Rollend
- Applicant: Martin H. Beck , George F. Rollend
- Applicant Address: NH Amherst
- Assignee: DTL Technology Limited Partnership
- Current Assignee: DTL Technology Limited Partnership
- Current Assignee Address: NH Amherst
- Main IPC: B29C45/16
- IPC: B29C45/16
Abstract:
A multi-cavity coinjection mold and method for simultaneously producing a plurality of multi-layered articles comprising: a mold structure defining a plurality of mold cavities; a first supply source for supplying metered amounts of a first molding material; a second supply source for supplying metered amounts of a second molding material; a hot runner system in communication with the first and second supply sources for conveying the metered amounts of the first and the second materials separately to a region proximate each of the cavities; a valve mechanism per cavity for receiving the metered amounts of the first and second materials from the hot runner system and for sequentially supplying desired quantity of the first and second materials contiguously to each cavity.
Public/Granted literature
- US5357514A Distributed bit-by-bit destuffing circuit for byte-stuffed multiframe data Public/Granted day:1994-10-18
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