发明授权
- 专利标题： Method of manufacturing ball grid arrays for improved testability
- 专利标题（中）： 制造球栅阵列以提高可测性的方法
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申请号： US970184申请日： 1997-11-14
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公开(公告)号： US5924003A公开(公告)日： 1999-07-13
- 发明人: Alexander H. Slocum
- 申请人： Alexander H. Slocum
- 申请人地址： NH Bedford
- 专利权人： Kinetrix, Inc.
- 当前专利权人： Kinetrix, Inc.
- 当前专利权人地址： NH Bedford
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/498 ; H05K3/34 ; H01L21/44
摘要：
A ball grid array package for integrated circuit chips that is designed to facilitate testing. The balls are planarized with high precision to make electrical contact more accurate for testing. Contact, even on fine pitched arrays, can be readily made. A machine for planarizing the solder balls is disclosed. Also, a contact array, as well as a method of making the contact array are disclosed.
公开/授权文献
- USD263951S Electrical accessory plug for automobile lighter outlet 公开/授权日：1982-04-20
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