发明授权
US5930623A Method of forming a data storage capacitor with a wide electrode area for dynamic random access memory using double spacers 失效
使用双间隔物形成具有宽电极区域的数据存储电容器用于动态随机存取存储器的方法

  • 专利标题: Method of forming a data storage capacitor with a wide electrode area for dynamic random access memory using double spacers
  • 专利标题(中): 使用双间隔物形成具有宽电极区域的数据存储电容器用于动态随机存取存储器的方法
  • 申请号: US5449
    申请日: 1998-01-12
  • 公开(公告)号: US5930623A
    公开(公告)日: 1999-07-27
  • 发明人: Der-Yuan Wu
  • 申请人: Der-Yuan Wu
  • 申请人地址: TWX Hsin-Chu
  • 专利权人: United Microelectronics, Corporation
  • 当前专利权人: United Microelectronics, Corporation
  • 当前专利权人地址: TWX Hsin-Chu
  • 优先权: TWX86117699 19971125
  • 主分类号: H01L21/8242
  • IPC分类号: H01L21/8242 H01L27/108
Method of forming a data storage capacitor with a wide electrode area
for dynamic random access memory using double spacers
摘要:
A method is provided for use on a DRAM (dynamic random access memory) device for forming a data storage capacitor with a wide electrode area, and thus a high capacitance, for the DRAM device. The high capacitance allows the data storage capacitor to preserve high data retaining capability when the DRAM device is downsized for high integration. The method is characterized in the forming of silicon-nitride based sidewall spacers and polysilicon-based sidewall spacers in openings formed in oxide layers that allows the subsequently formed contact window to be narrowed to a reduced width, thereby preventing the subsequent etching process to damage the nearby polysilicon-based bit lines and gate electrodes due to misalignment in the etching. Moreover, the method allows the resultant data storage capacitor to have a wide electrode area that helps increase the capacitance thereof, thereby allowing the DRAM device to preserve a high and reliable data retaining capability to the data stored therein.
公开/授权文献
信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L21/00 专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70 .由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理;集成电路器件或其特殊部件的制造(由预制电组件组成的组装件的制造入H05K3/00,H05K13/00)
H01L21/77 ..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理(电可编程只读存储器或其多步骤的制造方法入H01L27/115)
H01L21/78 ...把衬底连续地分成多个独立的器件(改变表面物理特性或者半导体形状的切割入H01L21/304)
H01L21/82 ....制造器件,例如每一个由许多元件组成的集成电路
H01L21/822 .....衬底是采用硅工艺的半导体的(H01L21/8258优先)
H01L21/8232 ......场效应工艺
H01L21/8234 .......MIS工艺
H01L21/8239 ........存储器结构
H01L21/8242 .........动态随机存取存储结构(DRAM)
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