发明授权
- 专利标题： Barrier layers for electroplated SnPb eutectic solder joints
- 专利标题（中）： 电镀SnPb共晶焊点的阻隔层
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申请号： US57205申请日： 1998-04-08
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公开(公告)号： US5937320A公开(公告)日： 1999-08-10
- 发明人: Panayotis Constantinou Andricacos , Madhav Datta , Wilma Jean Horkans , Sung Kwon Kang , Keith Thomas Kwietniak
- 申请人： Panayotis Constantinou Andricacos , Madhav Datta , Wilma Jean Horkans , Sung Kwon Kang , Keith Thomas Kwietniak
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L23/485
- IPC分类号： H01L23/485 ; H01L21/44
摘要：
The present invention provides a means of fabricating a reliable C4 flip-chip structure for low-temperature joining. The electrochemically fabricated C4 interconnection has a barrier layer between the electroplated tin-rich solder bump and the ball-limiting metallurgy that protects the terminal metal in the ball-limiting metallurgy from attack by the Sn in the solder. The barrier layer is electroplated through the same photoresist mask as the solder and thus does not require a separate patterning step. A thin layer of electroplated nickel serves as a reliable barrier layer between a copper-based ball-limiting metallurgy and a tin-lead (Sn--Pb) eutectic C4 ball.
公开/授权文献
- USD384173S Electrodeless compact fluorescent lamp 公开/授权日：1997-09-23
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