发明授权
- 专利标题： Process of removing flux residue from microelectronic components
- 专利标题（中）： 从微电子元件去除焊剂残留物的过程
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申请号： US876141申请日： 1997-06-13
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公开(公告)号： US5938856A公开(公告)日： 1999-08-17
- 发明人: Krishna G. Sachdev , Umar M. Ahmad , John U. Knickerbocker , Chon C. Lei
- 申请人： Krishna G. Sachdev , Umar M. Ahmad , John U. Knickerbocker , Chon C. Lei
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： C11D7/26
- IPC分类号： C11D7/26 ; C11D7/50 ; C11D11/00 ; H01L21/304 ; H01L21/48 ; H05K3/26 ; B08B7/00
摘要：
This invention relates to the use of non-halogenated and non-aromatic cleaning solvents as environmentally safe replacement of perchloroethylene and xylene to remove rosin flux residue formed on electronic circuit device materials during solder interconnection process for assembly of electronic components.
公开/授权文献
- US5429654A Coated agricultural products 公开/授权日：1995-07-04
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