发明授权
US5939473A Epoxy resin, resin composition, and resin-encapsulated semiconductor
device
失效
环氧树脂,树脂组合物和树脂封装的半导体器件
- 专利标题: Epoxy resin, resin composition, and resin-encapsulated semiconductor device
- 专利标题(中): 环氧树脂,树脂组合物和树脂封装的半导体器件
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申请号: US639506申请日: 1996-04-29
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公开(公告)号: US5939473A公开(公告)日: 1999-08-17
- 发明人: Yasuhiro Hirano , Masatsugu Akiba , Akira Yokota , Hiroshi Nakamura , Shigeki Naitoh
- 申请人: Yasuhiro Hirano , Masatsugu Akiba , Akira Yokota , Hiroshi Nakamura , Shigeki Naitoh
- 申请人地址: JPX Osaka
- 专利权人: Sumitomo Chemical Company, Limited
- 当前专利权人: Sumitomo Chemical Company, Limited
- 当前专利权人地址: JPX Osaka
- 优先权: JPX7-104464 19950427; JPX7-106768 19950428; JPX7-106769 19950428; JPX7-108418 19950502
- 主分类号: C07C39/21
- IPC分类号: C07C39/21 ; C07C39/215 ; C07D301/28 ; C07D303/23 ; C07D303/24 ; C08G59/24 ; H01L23/29 ; H05K1/03
摘要:
The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.
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