DENTAL COMPOSITION
    3.
    发明申请
    DENTAL COMPOSITION 审中-公开

    公开(公告)号:US20190209440A1

    公开(公告)日:2019-07-11

    申请号:US16357862

    申请日:2019-03-19

    发明人: Joachim KLEE

    摘要: Dental composition comprising (a) at least two di- or polyepoxides having 2 to 5 epoxide groups and having a molecular weight of from 200 to 700 Da, or a macromonomeric reaction product obtainable by reacting the diepoxide with a dicarboxylic acid in a molar ratio [diepoxide]/[dicarboxylic acid] of at least 2; (b) one or more primary monoamines and/or disecondary diamines; (c) optionally one or more aliphatic polyamines; (d) a particulate filler, wherein the molar ratio of epoxide groups in component (a) to the N—H bonds in component (b) and (c) [epoxide(a)]/[N—H(b),(c)] is in the range of from 0.9 to 1.1; wherein the di- or polyepoxide having 2 to 5 epoxide groups is a compound of the following formula (I): A(BZm)n   (I) wherein A represents an n-valent organic moiety optionally having 1 to 10 heteroatoms selected from oxygen atoms and sulfur atoms; and B represents an m+1-valent organic moiety, Z is an epoxide group which may have a substituent, m which are independent from each other represent an integer of at least 1; and n is an integer of from 1 to 5; wherein the m are selected so that 2 to 5 epoxide groups are present; wherein the composition does not contain any 2,2-bis-(4-hydroxyphenyl)-propane, or 2,2-bis-(4-hydroxyphenyl)-methane.

    Epoxy resin, resin composition, and resin-encapsulated semiconductor
device
    5.
    发明授权
    Epoxy resin, resin composition, and resin-encapsulated semiconductor device 失效
    环氧树脂,树脂组合物和树脂封装的半导体器件

    公开(公告)号:US5939473A

    公开(公告)日:1999-08-17

    申请号:US639506

    申请日:1996-04-29

    摘要: The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.

    摘要翻译: 具有两个不同芳基的二苯乙烯环氧树脂和包含该二苯乙烯环氧树脂的环氧树脂混合物具有比具有两个相同芳基的二苯乙烯环氧树脂和后者二苯乙烯环氧树脂的环氧树脂混合物的熔点低的熔点。 与常规树脂相比,本发明的树脂或树脂混合物具有改进的加工和成型性能,缩短了成型和加工过程所需的时间,从而产生经济上的优点和对生产率的优选影响。 本发明的环氧树脂或树脂混合物优选用作粘合剂,涂料,绝缘材料,层压片材的电气或电子材料等。 它特别适用于封装电子部件的材料。