发明授权
- 专利标题： Multilayer substrates methods for manufacturing multilayer substrates and electronic devices
- 专利标题（中）： 用于制造多层基板和电子器件的多层基板方法
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申请号： US893323申请日： 1997-07-16
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公开(公告)号： US5939789A公开(公告)日： 1999-08-17
- 发明人: Michifumi Kawai , Ryohei Satoh , Osamu Yamada , Eiji Matsuda , Masakazu Ishino , Takashi Inoue , Hideo Sotokawa , Masayuki Kyoui
- 申请人： Michifumi Kawai , Ryohei Satoh , Osamu Yamada , Eiji Matsuda , Masakazu Ishino , Takashi Inoue , Hideo Sotokawa , Masayuki Kyoui
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX6-030256 19940228
- 主分类号： H05K3/46
- IPC分类号： H05K3/46 ; H01L21/48 ; H05K3/28 ; H05K3/42 ; H01L23/485
摘要：
A multilayer substrate which is fabricated by laminating a plurality of substrates, each comprising an insulation film, a plurality of via holes which pass through the upper surface to the lower surface of the insulation film, a wiring which is provided on the upper surface of the insulation film and the upper surface of the via holes and electrically connected with the via holes, a bonding member which is provided on the lower surfaces of the via holes and electrically connected with the via holes, and a bonding layer which is provided on the upper surface of the insulation film where the wiring is formed and the method of fabrication thereof whereby large costs reduction and high density effect can be obtained.
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