Invention Grant
- Patent Title: Paste application and recovery system for IPC termination unit
- Patent Title (中): 粘贴IPC终端单元的应用和恢复系统
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Application No.: US944329Application Date: 1997-10-06
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Publication No.: US5944897APublication Date: 1999-08-31
- Inventor: Denver Braden
- Applicant: Denver Braden
- Applicant Address: CA San Marcos
- Assignee: Chip Star, Inc.
- Current Assignee: Chip Star, Inc.
- Current Assignee Address: CA San Marcos
- Main IPC: B05C21/00
- IPC: B05C21/00
Abstract:
An improved chip termination or application wheel for applying a layer of silver paste to the edge or end of a chip including a wheel that is defined by a broad circumferential surface, for contact with the chip, the surface containing an increased surface area for accepting a larger amount of termination paste for transfer to the edge of a chip.
Public/Granted literature
- USD260536S Clipboard Public/Granted day:1981-09-01
Information query
