公开(公告)号：US5944897A

公开(公告)日：1999-08-31

申请号：US944329

申请日：1997-10-06

Applicant: Denver Braden

Inventor： Denver Braden

IPC: B05C21/00

CPC classification number: H01G13/006 ,  B05C1/027 ,  B05C1/08 ,  H05K3/3442

Abstract: An improved chip termination or application wheel for applying a layer of silver paste to the edge or end of a chip including a wheel that is defined by a broad circumferential surface, for contact with the chip, the surface containing an increased surface area for accepting a larger amount of termination paste for transfer to the edge of a chip.

Abstract translation: 一种用于将银浆涂层施加到芯片的边缘或端部的改进的芯片端接或应用轮，包括由宽的圆周表面限定的轮，用于与芯片接触，所述表面包含增加的表面积用于接受 更大量的终止浆料用于转移到芯片的边缘。

公开(公告)号：US5226382A

公开(公告)日：1993-07-13

申请号：US702309

申请日：1991-05-20

Applicant: Denver Braden

Inventor： Denver Braden

IPC: H01G13/00

CPC classification number: H01G13/006

Abstract: Apparatus for automatically metalizing the terminal ends of monolithic capacitor chips, which includes an endless conveying tape having formed therein a plurality of first apertures, a plurality of thin, resilient masks, each adapted for receipt in one of the apertures, in co-planar, fixed registration therewith, each mask having at least one second aperture formed therethrough of a size and shape to compliantly receive a chip therein, in an orientation whereby the contact surfaces extend outward from both sides of the tape, a way to for load the masks with a plurality of chips including a cylindrical wall having formed therethrough at least one orifice for registration with the second aperture in the mask, the cylindrical wall adapted for rotation through an inventory of the chips for introduction of the chips into the orifice in transverse specific alignment with their contact surfaces extending outward from the cylindrical wall orifices, a way to accurately move the chip-loaded orifices into registration with the second apertures in the masks, a way to transfer the chips from the orifices into the second apertures along a rectilinear path therebetween, a way to pass the contact surfaces of the chips through an inventory of end-termination paste, and, a way to dry the paste and expel the chips from the mask to prepare the masks to receive a new inventory of chips as the endless conveying tape proceeds to repeat its circuit.

Abstract translation: 用于自动金属化单片电容器芯片的端部的装置，其包括在其中形成有多个第一孔的环形输送带，多个薄的弹性掩模，每个适于在共同的一个孔中接收， 每个掩模具有通过其形成的尺寸和形状的至少一个第二孔，以顺向地容纳其中的芯片，其中接触表面从带的两侧向外延伸，用于将带有加载的方法 包括圆柱形壁的多个芯片，其中形成有至少一个用于与掩模中的第二孔对准的孔的圆柱形壁，该圆柱形壁适于旋转通过芯片的库存，以将切屑引入孔中以横向特定对准 它们的接触表面从圆柱形壁孔向外延伸，以准确地移动芯片加载的孔 它们与掩模中的第二孔对准，沿着它们之间的直线路径将碎屑从孔口传送到第二孔中的方法，使芯片的接触表面通过端接浆料的库存通过的方法，以及 ，一种干燥糊状物并从掩模中排出碎片的方法，以准备面罩，以在环形输送带继续重复其电路时接收新的碎屑库存。

公开(公告)号：US4526129A

公开(公告)日：1985-07-02

申请号：US313785

申请日：1981-10-22

Applicant: Denver Braden

Inventor： Denver Braden

IPC: B05D1/00 ,  H01G13/00 ,  H05K13/02 ,  B05C13/02

CPC classification number: B05D1/00 ,  H01G13/00 ,  H01G13/006 ,  H05K13/028 ,  Y10S269/90 ,  Y10T29/53261 ,  Y10T428/24322

Abstract: Miniature electronic component parts such as capacitors or resistors are end conductively coated by use of a part handling plate having a multiplicity of passageways therethrough with walls coated by resilient material to grip the parts. A bank of pins in a press (a) are used to move the parts in the passageways, (b) are used to load the parts into the passageways through the use of a loading plate housing part receiving openings filled with parts by the use of vibration equipment, and (c) are used to discharge the parts from the passageways into the recesses of an unloading plate. The parts are moved in the passageways first to expose one end to be coated and then second to expose the other end of the parts to be coated.

Abstract translation: 诸如电容器或电阻器的微型电子部件部分通过使用具有多个通道的部件处理板进行导电涂覆，其中通过弹性材料涂覆的壁以夹持部件。 压机（a）中的一排销用于移动通道中的部件，（b）用于通过使用装载板壳体部件将部件装载到通道中，该部件通过使用 振动设备和（c）用于将部件从通道排出到卸载板的凹部中。 这些部件首先在通道中移动以露出待涂覆的一端，然后第二次暴露待涂覆部件的另一端。

公开(公告)号：US5673799A

公开(公告)日：1997-10-07

申请号：US464310

申请日：1995-06-05

Applicant: Denver Braden

Inventor： Denver Braden

IPC: B07C5/344 ,  G01R31/01 ,  G01R31/02

CPC classification number: B07C5/344 ,  G01R31/016 ,  Y10S209/919

Abstract: A method of continuously testing and sorting large quantities of capacitor chips, including the steps of loading the chips into identical rows of aligned positions in a rotatable member, simultaneously and sequentially rotating the member to advance the chips past a plurality of testing stations and past subsequent sorting stations, each station successively aligned momentarily with each row of the aligned chips, simultaneously and sequentially conducting a plurality of sequential electrical testing to the chips as they are rotated from test station to test station and classifying them in a plurality of ranges of values at the last test station, and at each subsequent sorting station, sequentially collecting chips belonging in one of the ranges of values until all the chips are collected before the rotating member returns for reloading.

Abstract translation: 一种连续测试和排序大量电容器芯片的方法，包括以下步骤：将芯片加载到可旋转构件中的相同排的对准位置中，同时并顺序地旋转构件以使芯片通过多个测试站并且随后过去 分选站，每个站连续对准每排对准的芯片，当它们从测试站旋转到测试站时，对芯片同时并顺序地进行多个顺序电测试，并将它们在多个值范围内进行分类 最后一个测试站，并且在每个后续的分选站，顺序地收集属于一个值范围内的芯片，直到所有的芯片在旋转部件返回重新加载之前被收集。

公开(公告)号：US4406373A

公开(公告)日：1983-09-27

申请号：US289320

申请日：1981-08-03

Applicant: Denver Braden

Inventor： Denver Braden

IPC: G01R31/18 ,  B07C5/344 ,  G01R31/01

CPC classification number: B07C5/344 ,  B07C5/368 ,  G01R31/016 ,  Y10S209/909 ,  Y10S209/936

Abstract: System of testing and sorting according to tested ranges of values of miniature electronic capacitor and resistor units. A planar carrier with rows and files of openings, loaded with such units, is disposed in an oblique plane to retain the units in place. The carrier is moved in a stepped manner past an electrical testing station and past a series of sorting stations. At the testing station, a file of probes is brought into electrical contact with one end of a set of electronic units in each file. A metal ply laminated in the carrier contacts the other end of the set of electronic units. A bridge network makes measurements by connecting to the file of probes and to the metal ply. A receptacle is disposed at each sorting station. As each file of electronic units passes the receptacles, the units are selectively deposited in the receptacles, by air jets, according to tested ranges of values.

Abstract translation: 根据微型电子电容器和电阻器单元的测试值的测试和排序系统。 具有装载有这种单元的开口行和文件的平面载体被设置在倾斜平面中以将单元保持在适当位置。 承运人以分步方式移动通过电气测试站并经过一系列分拣站。 在测试站，探头文件与每个文件中的一组电子单元的一端电接触。 层叠在载体中的金属层接触该组电子单元的另一端。 桥接网络通过连接到探头文件和金属层进行测量。 在每个分拣站处设置一个容器。 随着电子单元的每个文件通过插座，根据测试的值的范围，单元通过空气喷射器选择性地沉积在容器中。

公开(公告)号：US3982047A

公开(公告)日：1976-09-21

申请号：US580099

申请日：1975-05-22

Applicant: Denver Braden

Inventor： Denver Braden

IPC: B23K1/018 ,  H05K3/34 ,  C23C17/00

CPC classification number: B23K1/018 ,  H05K3/3442 ,  H05K3/3457

Abstract: An automatic soldering machine and method for soldering the ends of pretinned components such as ceramic chip capacitors, transistors and the like, while leaving one side of the component flat, is disclosed. The components are supplied by a vibratory feeder to a pick-up station where they are sequentially picked up by a vacuum probe and are transferred to a print station where a retaining mechanism comprising a spring biased finger and a metal plate retains the component. A plurality of these retaining mechanisms are secured to an indexing table which passes in succession a printing station, a preheating station, a soldering station and a take-off station. At the soldering station a predetermined amount of solder is fed to the ends of the components and a heat lamp is flashed to melt the solder.

Abstract translation: 公开了一种用于焊接诸如陶瓷片状电容器，晶体管等的预先装配的部件的端部，同时保持部件平坦的一侧的自动焊接机和方法。 这些部件由振动给料器供应到拾取站，在那里它们被真空探针顺序地拾取，并被传送到一个包括弹簧偏置的指状物和金属板的保持机构保持该部件的打印站。 多个这些保持机构被固定到分度台，分度台连续地通过印刷站，预热站，焊接站和起飞站。 在焊接站，预定量的焊料被供给到部件的端部，并且加热灯被闪光以熔化焊料。

公开(公告)号：US5540317A

公开(公告)日：1996-07-30

申请号：US373445

申请日：1995-01-17

Applicant: Denver Braden ,  David M. Brooks ,  Romulo V. DeVera

Inventor： Denver Braden ,  David M. Brooks ,  Romulo V. DeVera

IPC: B07C5/02 ,  B65G47/14

CPC classification number: B07C5/02

Abstract: In a capacitor chip processing apparatus, including a rotating loading wheel mounted on a spindle and carrying an inventory of chips, passageways formed in the wheel for receipt of chips from the inventory in controlled alignment, a belt containing resilient masks and having chip receiving holes brought into registration with the passageways, and motor-driven loading pins to advance, during the loading cycle, to push the chips from the passageways into the holes, a subassembly machine to detect and correct chip misalignment in the passageways, containing a load cell in communication with the loading pins and arranged to measure the resistance to pin travel as the pins come in contact with the chips in the passageways, a computer apparatus to compare the measured real time resistance to pin travel with a set resistance value from a list of absolute values or empirical studies, and a controller apparatus, activated by the computer apparatus, to control the motor-driven loading pins and the loading wheel in a remedial program to cure the misalignment of the chip in the passageway.

Abstract translation: 在电容器芯片处理装置中，包括安装在主轴上并携带库存盘的转动载荷轮，形成在车轮中的通道，用于以受控对准的方式从库存中接收碎屑，带有弹性掩模并带有芯片接收孔的带 与通道对准，并且马达驱动的加载销在加载循环期间推进以将芯片从通道推入孔中，子组件机器检测和校正通道中的芯片未对准，其中包含通信中的称重传感器 具有加载引脚并布置成当引脚与通道中的芯片接触时测量针脚行程的阻力，计算机设备将测得的实时电阻与引脚行程与来自绝对值列表的设定电阻值进行比较 或经验研究，以及由计算机设备激活的控制器装置，以控制电动机驱动的装载销和t 他在补救程序中加载轮来治愈通道中芯片的不对准。

公开(公告)号：USD255769S

公开(公告)日：1980-07-08

申请号：US910547

申请日：1978-04-20

Applicant: Denver Braden

Designer： Denver Braden

公开(公告)号：US06294747B1

公开(公告)日：2001-09-25

申请号：US09578787

申请日：2000-05-23

Applicant: Donald Liu ,  Denver Braden ,  Romulo V. de Vera ,  Malcolm Vincent Hawkes

Inventor： Donald Liu ,  Denver Braden ,  Romulo V. de Vera ,  Malcolm Vincent Hawkes

IPC: B07C5344

CPC classification number: B07C5/365 ,  B07C5/344 ,  Y10S209/919

Abstract: This invention is a visual inspection machine for a surface mount passive component (chip) made up of a rotating circular loader wheel inclined to the horizontal and including an upper exposed wheel surface against which an inventory of chips is placed for loading and a rim in which a plurality of cavities, of a size and shape to accept a single chip therein in an upright position, are formed, each cavity defined by a pair of spaced-apart cavity side walls, a rear cavity wall, and having a corner chamfer leading down thereinto from the wheel surface located on the side wail of the cavity in the direction of rotation of the loader wheel, a first vacuum station connected to the loader wheel for providing vacuum power in each cavity for retaining each chip in a cavity for a first inspection, a first inspection station, external the loader wheel, for viewing a first side surface of the chip during its location in the cavity on the loader wheel, a transfer wheel defined by an outer marginal edge, the wheel arranged planar to the loader wheel and in coordinated juxtaposed movement therewith for receiving the chips from the cavities in the loader wheel to the outer marginal edge of the transfer wheel for subsequent movement therewith, a second inspection station, external the transfer wheel, for viewing other external surfaces of the chips during their movement on the transfer wheel, computer/processor for tracking the positions of the chips that have passed and failed inspection by the first and the second inspection station, first removal means for ejecting chips that have failed inspection from the outer marginal edge of the transfer wheel for capture at a location, and a second removal station for removing chips that have passed inspection from the outer marginal edge of the transfer wheel for capture at another location.

Abstract translation: 本发明是一种用于表面安装的无源部件（芯片）的目视检查机，其由与水平方向倾斜的旋转的圆形装载机轮组成，并且包括上部暴露的轮面，用于装载的芯片的库存和边缘 形成尺寸和形状的多个空腔，以在直立位置上容纳其中的单个芯片，每个空腔由一对间隔开的空腔侧壁，后腔体壁限定，并且具有导向的角倒角 在位于所述空腔的侧壁的所述轮表面上的装载轮的旋转方向上的第一真空站，连接到所述装载轮的第一真空站，用于在每个空腔中提供真空功率，以将每个芯片保持在空腔中用于第一次检查 ，第一检查站，装载机轮外部，用于在其位于装载机轮中的腔中的位置处观察芯片的第一侧表面;传送轮，由外边缘 边缘，轮平面布置到装载机轮上并且与之并列运动，用于将装载轮中的空腔中的碎屑接收到传送轮的外边缘，用于随后的移动，第二检查站，传送轮外 ，用于在传送轮移动期间观察芯片的其它外表面，计算机/处理器，用于跟踪由第一和第二检查站检查的通过和失败的芯片的位置;第一去除装置，用于排出具有 从传送轮的外边缘进行检查，以便捕获在一个位置;以及第二移除站，用于去除已经通过检查从传送轮的外边缘进行检查的芯片，以便在另一位置捕获。

公开(公告)号：US4395184A

公开(公告)日：1983-07-26

申请号：US123201

申请日：1980-02-21

Applicant: Denver Braden

Inventor： Denver Braden

IPC: B05D1/00 ,  H01G13/00 ,  H05K13/02 ,  H05K3/30 ,  B65G65/04

CPC classification number: B05D1/00 ,  H01G13/00 ,  H01G13/006 ,  H05K13/028 ,  Y10S269/90 ,  Y10T29/53261 ,  Y10T428/24322

Abstract: Miniature electronic component parts such as capacitors or resistors are end conductively coated by use of a part handling plate having a multiplicity of passageways therethrough with walls coated by resilient material to grip the parts. A bank of pins in a press (a) are used to move the parts in the passageways, (b) are used to load the parts into the passageways through the use of a loading plate housing part receiving openings filled with parts by the use of vibration equipment, and (c) are used to discharge the parts from the passageways into the recesses of an unloading plate. The parts are moved in the passageways first to expose one end to be coated and then second to expose the other end of the parts to be coated.

Abstract translation: 诸如电容器或电阻器的微型电子部件部分通过使用具有多个通道的部件处理板进行导电涂覆，其中通过弹性材料涂覆的壁以夹持部件。 压机（a）中的一排销用于移动通道中的部件，（b）用于通过使用装载板壳体部件将部件装载到通道中，该部件通过使用 振动设备和（c）用于将部件从通道排出到卸载板的凹部中。 这些部件首先在通道中移动以露出待涂覆的一端，然后第二次暴露待涂覆部件的另一端。