发明授权
- 专利标题： Sputtering apparatus
- 专利标题（中）： 溅射装置
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申请号： US931651申请日： 1997-09-16
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公开(公告)号： US5944968A公开(公告)日： 1999-08-31
- 发明人: Masahiko Kobayashi , Masahito Ishihara , Hajime Sahase , Nobuyuki Takahashi
- 申请人： Masahiko Kobayashi , Masahito Ishihara , Hajime Sahase , Nobuyuki Takahashi
- 申请人地址： JPX Tokyo
- 专利权人： Anelva Corporation
- 当前专利权人： Anelva Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX8-269433 19960918
- 主分类号： C23C14/34
- IPC分类号： C23C14/34 ; C23C14/35 ; H01J37/34
摘要：
A sputtering apparatus is provided with a magnetic assembly which is rotated and revolved, and the eccentric distance between the rotation axis and the revolution axis is varied. By this arrangement, erosion profile of a target is made uniform, whereby a uniform thin film is deposited on a substrate surface.
公开/授权文献
- US4288542A Radioenzymatic assay of catecholamines 公开/授权日：1981-09-08
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