A method for protecting a substrate sheet such as a conductive foil suitable for use in the manufacture of printed circuit boards involving applying a lamination mold-release layer to one side of a protective film, and applying a preferably electron beam curable adhesive pressure-sensitive coating to the other side of the film, curing the adhesive coating, and laminating the protective film to the foil or other substrate sheet, which, in turn, may be laminated to other substrates such as dielectric sheets, and in which the laminate product is a protected substrate sheet having a protective film laminated to one side of the sheet (or both), the film having a lamination mold-release layer on one side thereof and an electron beam cured pressure-sensitive adhesive coating on the other side thereof, said other side contacting but being releasably detachable from said substrate sheet, and further wherein the substrate sheet is a foil or similar surface, protection is thus provided during handling and storage as well as during lamination, and the protective film is peelably detachable from the foil.