发明授权
US5948991A Semiconductor physical quantity sensor device having semiconductor
sensor chip integrated with semiconductor circuit chip
失效
具有与半导体电路芯片集成的半导体传感器芯片的半导体物理量传感器装置
- 专利标题： Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip
- 专利标题（中）： 具有与半导体电路芯片集成的半导体传感器芯片的半导体物理量传感器装置
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申请号： US979799申请日： 1997-11-26
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公开(公告)号： US5948991A公开(公告)日： 1999-09-07
- 发明人: Hiroshi Nomura , Yukihiro Kato , Akira Shintai
- 申请人： Hiroshi Nomura , Yukihiro Kato , Akira Shintai
- 申请人地址： JPX Kariya
- 专利权人： Denso Corporation
- 当前专利权人： Denso Corporation
- 当前专利权人地址： JPX Kariya
- 优先权： JPX8-328794 19961209; JPX8-329818 19961210
- 主分类号： B29C45/14
- IPC分类号： B29C45/14 ; G01L9/00 ; G01L9/02
摘要：
An IC chip for signal processing circuit is enclosed in a mold IC and a pressure sensitive element unit is integrally provided thereon. When the mold IC is housed in a case, the mold IC is fixed to the case under a state where ends of connector pins insert-molded to the case are electrically connected to external terminals of the mold IC. Thereby, a sensor signal is outputted from other ends of the connector pins. By integrating the IC chip for signal processing circuit in the mold IC, the IC chip for signal processing circuit can be protected against a contaminated environment at a location where the pressure sensitive element unit is arranged.
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