The invention provides a method and processing system for removing both anionic and cationic technetium complexes from an aqueous solution by adjusting the pH of the solution to greater than approximately 2, and directing the solution into an integrated resin and electrochemical plating device. The integrated resin and plating device has a resin bed or resin membrane in which is disposed one or more cathodes, and one or more anodes. A potential generator produces at least a 1 volt potential between the cathodes and the anodes. As the solution passes through the resin, the technetium complexes are adsorbed onto it. When a sufficient concentration of technetium complexes is adsorbed, the plating process can atlernatively be driven to plate out the technetium onto the cathodes, or to collect various species in system anolytes/catholytes.