发明授权
- 专利标题: Modulating surface morphology of barrier layers
- 专利标题(中): 调制阻挡层的表面形态
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申请号: US667842申请日: 1996-06-20
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公开(公告)号: US5956608A公开(公告)日: 1999-09-21
- 发明人: Nitin Khurana , Ted Guo
- 申请人: Nitin Khurana , Ted Guo
- 申请人地址: CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: CA Santa Clara
- 主分类号: H01L21/768
- IPC分类号: H01L21/768 ; H01L21/28 ; H01L21/306
摘要:
A process for fabricating electronic devices which includes the steps of providing a structure that includes a substrate with an overlying dielectric layer having one or more contact holes and/or vias formed therein; depositing a barrier layer over the structure so that the barrier layer penetrates into the contact holes and/or vias; plasma etching the deposited barrier layer so as to modify its surface morphology; and after modifying the surface morphology of the deposited barrier layer, depositing a metalization layer over the barrier layer. A two-step preclean to facet upper corners of the holes and/or vias and to clean bottoms of the holes and/or vias is performed prior to the deposition of the barrier layer.
公开/授权文献
- US5077825A Space heater mounted to ceiling fan 公开/授权日:1991-12-31