A process is disclosed for the preparation of a heat mode recording element comprising (A) laminating a layer pack (1) containing a temporary support, a release layer, a protective layer, an optional intermediate layer, a subbing layer and a thin metal layer, preferably a bismuth layer, to a layer pack (2) comprising a (thermo)adhesive layer and a permanent support, and (B) peeling off the temporary support and the release layer. In an alternative embodiment, when the protective layer contains a radiation-curable composition, the intermediate layer and the subbing layer can be omitted. A heat mode image is obtained by exposing information-wise a thus defined recording element by means of intense laser radiation, preferably produced by an infra-red laser.