A system for securing an electronic component, such as a CPU, includes a support extending substantially in a plane and a fastener coupled to the support. The support may be a heat sink secured to a component for dissipating heat generated during operation of the component. The fastener extends through extensions or fins of the heat sink, generally parallel to the plane of the heat sink and component package. A biasing spring urges the fastener toward a disengaged position. A biased retainer maintains the biasing spring and fastener within the assembly. The component is initially engaged in a receiving socket for installation. The fastener is then engaged in the mechanical support to draw the component into full engagement. A reference surface on the securement assembly contacts the mechanical support to limit engagement of the component. The fastener may include a torque-limiting assembly for limiting the torque applied to the mechanical support upon full engagement of the component.