发明授权
- 专利标题： Chemically amplified positive resist compositions
- 专利标题（中）： 化学扩增的正性抗蚀剂组合物
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申请号： US884503申请日： 1997-06-27
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公开(公告)号： US5972559A公开(公告)日： 1999-10-26
- 发明人: Satoshi Watanabe , Katsuya Takemura , Shigehiro Nagura
- 申请人： Satoshi Watanabe , Katsuya Takemura , Shigehiro Nagura
- 申请人地址： JPX
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JPX
- 优先权： JPX8-188461 19960628
- 主分类号： G03F7/004
- IPC分类号： G03F7/004 ; G03F7/039 ; H01L21/027
摘要：
A chemically amplified positive resist composition is prepared by blending (A) an organic solvent, (B) a base resin in the form of a polyhydroxystyrene having some hydroxyl groups replaced by acid labile groups and a Mw of 3,000-300,000, (C) a photoacid generator, and (D) an aromatic compound having a group: --R.sup.13 --COOH in a molecule. The resist composition is sensitive to actinic radiation, especially KrF excimer laser and X-ray, has high sensitivity, resolution, and plasma etching resistance, and is effective for improving the footing and PED on nitride substrates.
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