发明授权
US5972735A Method of preparing an electronic package by co-curing adhesive and
encapsulant
失效
通过粘合剂和密封剂的共固化制备电子封装的方法
- 专利标题： Method of preparing an electronic package by co-curing adhesive and encapsulant
- 专利标题（中）： 通过粘合剂和密封剂的共固化制备电子封装的方法
-
申请号： US115064申请日： 1998-07-14
-
公开(公告)号： US5972735A公开(公告)日： 1999-10-26
- 发明人: Christopher J. Dominic
- 申请人： Christopher J. Dominic
- 申请人地址： DE Wilmington
- 专利权人： National Starch and Chemical Investment Holding Corporation
- 当前专利权人： National Starch and Chemical Investment Holding Corporation
- 当前专利权人地址： DE Wilmington
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L21/56 ; H01L21/58 ; H01L23/04 ; H01L21/44 ; G01R31/26 ; H01L21/48
摘要：
A semi-conductor package in which an integrated circuit chip is connected to a substrate using wire-bonding is prepared by curing the die attach adhesive and encapsulating the wire bonds in one heating step. The encapsulant composition has a curing chemistry and a curing profile compatible with those of the adhesive.
公开/授权文献
- USD433770S Bulb attachment 公开/授权日：2000-11-14