发明授权
- 专利标题： Method for producing semiconductor chips
- 专利标题（中）： 半导体芯片的制造方法
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申请号： US940465申请日： 1997-09-30
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公开(公告)号： US5972781A公开(公告)日： 1999-10-26
- 发明人: Walter Wegleiter , Olaf Schoenfeld , Muk Wai Lui , Ernst Nirschl
- 申请人： Walter Wegleiter , Olaf Schoenfeld , Muk Wai Lui , Ernst Nirschl
- 申请人地址： DEX Munich CA Cupertino
- 专利权人： Siemens Aktiengesellschaft,Siemens Microelectronics, Inc.
- 当前专利权人： Siemens Aktiengesellschaft,Siemens Microelectronics, Inc.
- 当前专利权人地址： DEX Munich CA Cupertino
- 主分类号： H01L21/301
- IPC分类号： H01L21/301 ; H01L21/78
摘要：
Semiconductor chips are produced from a wafer. The semiconductor chips are separated from one another by etching the wafer all the way through, by a dry etching process, in defined separation zones between the semiconductor chips. Initially, first etching trenches for separating the p-n junctions are etched into the wafer. Then, second etching trenches are etched from the opposite side of the wafer until the individual semiconductor chips are completely separated.
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