公开(公告)号：US5972781A

公开(公告)日：1999-10-26

申请号：US940465

申请日：1997-09-30

申请人： Walter Wegleiter ,  Olaf Schoenfeld ,  Muk Wai Lui ,  Ernst Nirschl

发明人： Walter Wegleiter ,  Olaf Schoenfeld ,  Muk Wai Lui ,  Ernst Nirschl

IPC分类号： H01L21/301 ,  H01L21/78

CPC分类号： H01L21/78

摘要： Semiconductor chips are produced from a wafer. The semiconductor chips are separated from one another by etching the wafer all the way through, by a dry etching process, in defined separation zones between the semiconductor chips. Initially, first etching trenches for separating the p-n junctions are etched into the wafer. Then, second etching trenches are etched from the opposite side of the wafer until the individual semiconductor chips are completely separated.

摘要翻译： 半导体芯片由晶片制造。 半导体芯片通过在半导体芯片之间的限定分离区域中通过干法蚀刻工艺蚀刻晶片而彼此分离。 首先，将用于分离p-n结的第一蚀刻沟槽蚀刻到晶片中。 然后，从晶片的相对侧蚀刻第二蚀刻沟槽，直到各个半导体芯片完全分离。

公开(公告)号：US06531405B1

公开(公告)日：2003-03-11

申请号：US09250877

申请日：1999-02-16

申请人： Walter Wegleiter ,  Ernst Nirschl ,  Helmut Fischer

发明人： Walter Wegleiter ,  Ernst Nirschl ,  Helmut Fischer

IPC分类号： H01L21302

CPC分类号： H01L33/025 ,  H01L31/02363 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  Y02E10/50 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting and/or light-receiving semiconductor body is produced with one or more semiconductor layers composed of GaAsxP1−x, where 0≦x

摘要翻译： 制造具有由GaAs xP 1-x组成的一个或多个半导体层的发光和/或光接收半导体本体，其中0 <= x <1。 在第一蚀刻步骤中首先用蚀刻溶液H 2 SO 4 :H 2 O 2 :H 2 O处理半导体层表面的至少一部分，然后在第二蚀刻步骤中用氢氟酸处理。 蚀刻导致半导体层的表面的处理部分上的表面粗糙度。

公开(公告)号：US5654559A

公开(公告)日：1997-08-05

申请号：US637581

申请日：1996-04-25

申请人： Werner Spaeth ,  Norbert Stath ,  Ernst Nirschl ,  Walter Wegleiter ,  Werner Kuhlmann ,  Rudolf Buchberger

发明人： Werner Spaeth ,  Norbert Stath ,  Ernst Nirschl ,  Walter Wegleiter ,  Werner Kuhlmann ,  Rudolf Buchberger

IPC分类号： H01L23/48 ,  H01L25/065 ,  H01L31/173 ,  H01L31/167

CPC分类号： H01L23/48 ,  H01L31/173 ,  H01L2224/48463

摘要： An optical coupling device and method for manufacturing the same is disclosed wherein a light-emitting semiconductor transmitter chip is secured to a light-detecting semiconductor receiver chip via a transparent insulating layer, a structured spacer layer and a transparent connecting layer. The resultant optocoupler has a high coupling factor and may be reliably manufactured into SMT compatible packages.

摘要翻译： 公开了一种光耦合器件及其制造方法，其中通过透明绝缘层，结构化间隔层和透明连接层将发光半导体发射器芯片固定到光检测半导体接收器芯片。 所得的光耦合器具有高耦合系数，并且可以可靠地制造成与SMT兼容的封装。

公开(公告)号：US09419193B2

公开(公告)日：2016-08-16

申请号：US13505283

申请日：2010-10-05

申请人： Bernd Barchmann ,  Axel Kaltenbacher ,  Norbert Stath ,  Walter Wegleiter ,  Karl Weidner ,  Ralph Wirth

发明人： Bernd Barchmann ,  Axel Kaltenbacher ,  Norbert Stath ,  Walter Wegleiter ,  Karl Weidner ,  Ralph Wirth

IPC分类号： H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L25/075

CPC分类号： H01L33/62 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L2224/24998 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/00

摘要： An opto-electronic component has a carrier element (3) with a connection region (5). Arranged on the carrier element (3) is a semiconductor chip (7). A contact region (10) is mounted on the surface (8) of the semiconductor chip (7) remote from the carrier element (3). The connection region (5) is electrically conductively connected to the contact region (10) by way of an unsupported conductive structure (13). A method for manufacturing an opto-electronic component is described.

摘要翻译： 光电子部件具有带有连接区域（5）的载体元件（3）。 在载体元件（3）上排列的是半导体芯片（7）。 接触区域（10）安装在远离载体元件（3）的半导体芯片（7）的表面（8）上。 连接区域（5）通过未支撑的导电结构（13）导电地连接到接触区域（10）。 描述了一种用于制造光电子部件的方法。

公开(公告)号：US08749025B2

公开(公告)日：2014-06-10

申请号：US12678363

申请日：2008-09-24

申请人： Elmar Baur ,  Walter Wegleiter

发明人： Elmar Baur ,  Walter Wegleiter

IPC分类号： H01L21/00 ,  H01L33/00

摘要： A semiconductor chip is specified that has a contact layer that is not optimum for many common applications. For example, the contact layer is too thin to tolerate an operating current intended for the semiconductor chip without considerable degradation. Also specified is an optoelectronic component in which the semiconductor chip can be integrated so that the suboptimal quality of the contact layer is compensated for. In the component the semiconductor chip is applied to a carrier body so that the contact layer is arranged on a side of the semiconductor body that is remote from the carrier body. The semiconductor chip and the carrier body are at least partly covered with an electrically isolating layer, and an electrical conductor applied to the isolating layer extends laterally away from the semiconductor body and contacts at least a partial surface of the contact layer. In addition, an advantageous process for producing the component is specified.

公开(公告)号：US08513682B2

公开(公告)日：2013-08-20

申请号：US12808953

申请日：2008-12-11

申请人： Walter Wegleiter ,  Norbert Stath ,  Bert Braune ,  Karl Weidner ,  Matthias Rebhan ,  Hans Wulkesch

发明人： Walter Wegleiter ,  Norbert Stath ,  Bert Braune ,  Karl Weidner ,  Matthias Rebhan ,  Hans Wulkesch

IPC分类号： H01L33/00

CPC分类号： H01L51/52 ,  H01L24/24 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/46 ,  H01L33/60 ,  H01L51/5253 ,  H01L51/5284 ,  H01L2224/73267 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/00

摘要： An optoelectronic component includes a carrier element. At least two elements are arranged in an adjacent fashion on a first side of the carrier element. Each element has at least one optically active region for generating the electromagnetic radiation. The optoelectronic component has an electrically insulating protective layer arranged at least in part on a surface of the at least two adjacent elements which lies opposite the first side. The protective layer, at least in a first region arranged between the at least two adjacent elements, at least predominantly prevents a transmission of the electromagnetic radiation generated by the optically active regions.

摘要翻译： 光电子部件包括载体元件。 至少两个元件以相邻方式布置在载体元件的第一侧上。 每个元件具有用于产生电磁辐射的至少一个光学活性区域。 光电子部件具有至少部分地布置在与第一侧相对的至少两个相邻元件的表面上的电绝缘保护层。 至少在布置在所述至少两个相邻元件之间的第一区域中的保护层至少主要地防止由光学活性区域产生的电磁辐射的透射。

公开(公告)号：US20110024790A1

公开(公告)日：2011-02-03

申请号：US12934327

申请日：2009-03-26

申请人： Walter Wegleiter ,  Ralph Wirth ,  Bernd Barchmann

发明人： Walter Wegleiter ,  Ralph Wirth ,  Bernd Barchmann

IPC分类号： H01L33/48 ,  H01L31/0203 ,  H01L31/18

CPC分类号： H01L33/44 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/1815 ,  H01L2924/00014

摘要： An optoelectronic semiconductor component includes a connection support with a connection side, at least one optoelectronic semiconductor chip mounted on the connection side and electrically connected to the connection support, an adhesion-promoting intermediate film applied to the connection side and covering the latter at least in selected places, and at least one radiation-transmissive cast body which at least partially surrounds the semiconductor chip, the cast body being connected mechanically to the connection support by the intermediate film.

摘要翻译： 光电子半导体部件包括具有连接侧的连接支撑件，安装在连接侧并电连接到连接支撑件的至少一个光电子半导体芯片，施加到连接侧并且至少覆盖连接侧的粘合促进中间膜 以及至少一个至少部分地围绕半导体芯片的辐射透射铸塑体，铸造体通过中间膜机械连接到连接支撑件。

公开(公告)号：US20100117103A1

公开(公告)日：2010-05-13

申请号：US12529137

申请日：2008-02-29

申请人： Jan Marfeld ,  Walter Wegleiter ,  Moritz Engl

发明人： Jan Marfeld ,  Walter Wegleiter ,  Moritz Engl

IPC分类号： H01L33/00 ,  H01L21/30

CPC分类号： H01L25/0753 ,  H01L24/24 ,  H01L24/82 ,  H01L33/44 ,  H01L33/508 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00014

摘要： A light-emitting module includes a supporting element, a number of optoelectronic semiconductor components mounted on the supporting element for the generation of electromagnetic radiation, and a metallic connecting layer by means of which the optoelectronic semiconductor components are supplied with operating voltage. An insulation layer is arranged in a region of the optoelectronic semiconductor components between the supporting element and the metallic connecting layer. The metallic connecting layer forms a light shade for the optoelectronic semiconductor components, so that the electromagnetic radiation is only emitted in a specified direction.

摘要翻译： 发光模块包括支撑元件，安装在用于产生电磁辐射的支撑元件上的多个光电子半导体元件，以及金属连接层，通过该金属连接层向光电半导体元件提供工作电压。 绝缘层布置在支撑元件和金属连接层之间的光电子半导体部件的区域中。 金属连接层形成光电子半导体部件的光阴，使得电磁辐射仅沿指定方向发射。

公开(公告)号：US06828597B2

公开(公告)日：2004-12-07

申请号：US10237472

申请日：2002-09-09

申请人： Walter Wegleiter ,  Klaus Streubel

发明人： Walter Wegleiter ,  Klaus Streubel

IPC分类号： H01L2922

CPC分类号： H01L33/387 ,  H01L33/20 ,  H01L33/44

摘要： In a radiation-emitting semiconductor component having a semiconductor body that comprises a radiation-generating active layer, having a central front-side contact on a front side of the semiconductor body and a back-side contact on a back side of the semiconductor body for impressing a current into the semiconductor body containing the active layer, the back-side contact comprises a plurality of contact locations spaced from one another, whereby the size of the contact locations increases with increasing distance from the central front-side contact.

摘要翻译： 在具有半导体主体的辐射发射半导体部件中，该半导体器件包括辐射发生有源层，在半导体本体的前侧具有中心前侧接触和在半导体本体的背面上具有背面接触， 将电流施加到包含有源层的半导体本体中，背面接触包括彼此间隔开的多个接触位置，由此随着距离中心前侧接触件的距离的增加，接触位置的大小增加。

公开(公告)号：US08847247B2

公开(公告)日：2014-09-30

申请号：US13394097

申请日：2010-08-06

申请人： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Oliver Wutz ,  Jan Marfeld

发明人： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Oliver Wutz ,  Jan Marfeld

IPC分类号： H01L29/18 ,  H01L33/44 ,  H01L23/00 ,  H01L33/62 ,  H01L25/075 ,  H01L33/50

CPC分类号： H01L33/44 ,  H01L24/24 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

摘要： An optoelectronic module is provided which comprises a first semiconductor body (2) with a radiation exit side (2a) on which an electrical connection region (21, 22) is arranged. The first semiconductor body (2) is arranged with its side opposite the radiation exit side (2a) on a carrier (1). An insulation material (3) is arranged on the carrier (1) laterally next to the first semiconductor body (2), which material forms a fillet and adjoins the semiconductor body (2) form-fittingly. An insulation layer (4) is arranged at least in places on the first semiconductor body (2) and the insulation material (3), on which layer a planar conductive structure is arranged for planar contacting of the first semiconductor body (2), which conductive structure is electrically conductively connected with the electrical connection region (21, 22). A method of producing such an optoelectronic module is furthermore provided.

摘要翻译： 提供了一种光电模块，其包括具有辐射出射侧（2a）的第一半导体本体（2），电连接区域（21,22）布置在其上。 第一半导体本体（2）的一侧与辐射出口侧（2a）相对设置在载体（1）上。 绝缘材料（3）在第一半导体本体（2）的横向方向上布置在载体（1）上，该材料形成一个圆角并且与半导体本体（2）形成适当的连接。 绝缘层（4）至少布置在第一半导体本体（2）和绝缘材料（3）上的位置上，其上布置有用于第一半导体主体（2）的平面接触的平面导电结构的层， 导电结构与电连接区域（21,22）导电连接。 此外还提供了制造这种光电子模块的方法。