The present invention is a contamination measuring device and method of using the same according to a Chemical Mechanical Polishing (CMP) brush cleaner equipment/technology. A collection device is mounted in a brush cleaning device for collecting effluent which flows off of a wafer. The effluent is passed to a particle counter which measures the contamination levels of the effluent. A computer stores the data collected by the particle counter and computes the particles per liter of effluent and provides real time data. The contamination of the effluent corresponds to the contamination of the brushes in the cleaning device and therefore is means for predicting when the brushes in the cleaning device should be replaced.