发明授权
US5977575A Semiconductor sensor device comprised of plural sensor chips connected
to function as a unit
失效
半导体传感器装置由连接起来作为一个单元的多个传感器芯片组成
- 专利标题： Semiconductor sensor device comprised of plural sensor chips connected to function as a unit
- 专利标题（中）： 半导体传感器装置由连接起来作为一个单元的多个传感器芯片组成
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申请号： US54074申请日： 1993-04-27
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公开(公告)号： US5977575A公开(公告)日： 1999-11-02
- 发明人: Masaaki Mandai , Hitoshi Takeuchi , Yutaka Saito , Tomoyuki Yoshino
- 申请人： Masaaki Mandai , Hitoshi Takeuchi , Yutaka Saito , Tomoyuki Yoshino
- 申请人地址： JPX Chiba
- 专利权人： Seiko Instruments Inc.
- 当前专利权人： Seiko Instruments Inc.
- 当前专利权人地址： JPX Chiba
- 优先权： JPX4-108159 19920427; JPX4-284666 19921020; JPX4-297193 19921106; JPX4-299650 19921110; JPX5-29493 19930218
- 主分类号： H01L21/98
- IPC分类号： H01L21/98 ; H01L23/538 ; H01L25/18 ; H01L27/148
摘要：
The semiconductor image sensor device of the multiple chip mount type is constructed such that electrical and mechanical connections are carried out concurrently among chips. Coupling chips 4 are utilized to couple a plurality of semiconductor image sensor chips 1 with each other, and the couple one semiconductor image sensor chip 1 to a driver substrate 3 which mounts thereon a semiconductor driving chip 2 for driving the semiconductor image sensor chips 1.