Invention Grant
- Patent Title: Semiconductor laminating structure
- Patent Title (中): 半导体层压结构
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Application No.: US839903Application Date: 1997-04-18
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Publication No.: US5981980APublication Date: 1999-11-09
- Inventor: Takao Miyajima , Yann Le Bellego , Hiroji Kawai
- Applicant: Takao Miyajima , Yann Le Bellego , Hiroji Kawai
- Applicant Address: JPX Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JPX Tokyo
- Priority: JPX8-100350 19960422
- Main IPC: H01L29/201
- IPC: H01L29/201 ; H01L29/812 ; H01L33/00 ; H01L33/16
Abstract:
To provide a semiconductor laminating structure in which an epitaxial growth of a GaN system material is achieved on a substrate with an excellent matching property with the substrate. The semiconductor laminating structure includes the substrate having a perovskite structure and at least one GaN system chemical compound semiconductor layer formed on the substrate, wherein a major surface of the substrate is formed of a (111) crystal surface.
Public/Granted literature
- US5253286A Apparatus for focusing image in television camera for video telephone Public/Granted day:1993-10-12
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