- 专利标题: High breakdown voltage semiconductor device
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申请号: US251489申请日: 1999-02-17
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公开(公告)号: US5982015A公开(公告)日: 1999-11-09
- 发明人: Keizo Hirayama , Hideyuki Funaki , Fumito Suzuki , Akio Nakagawa
- 申请人: Keizo Hirayama , Hideyuki Funaki , Fumito Suzuki , Akio Nakagawa
- 申请人地址: JPX Kawasaki
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JPX Kawasaki
- 优先权: JPX10-036251 19980218
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/40 ; H01L29/47 ; H01L29/861 ; H01L29/872 ; H01L27/095 ; H01L29/812 ; H01L31/07
摘要:
Disclosed is a high breakdown voltage semiconductor device comprising a semiconductor substrate, an active layer consisting of a high resistivity semiconductor layer of a first conductivity type formed on the substrate with an insulating layer interposed therebetween, a first impurity region of the first conductivity type formed within the active layer, a second impurity region of a second conductivity type formed within the active layer, a third impurity region of the second conductivity type formed within the second impurity region and having a high impurity concentration, a first electrode being in ohmic contact with the first impurity region and the fourth impurity region, and a second electrode being in Schottky contact with the second impurity region and in ohmic contact with the third impurity region.
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