Invention Grant
US5982166A Method for measuring a characteristic of a semiconductor wafer using
cylindrical control
失效
使用圆柱形控制来测量半导体晶片的特性的方法
- Patent Title: Method for measuring a characteristic of a semiconductor wafer using cylindrical control
- Patent Title (中): 使用圆柱形控制来测量半导体晶片的特性的方法
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Application No.: US790260Application Date: 1997-01-27
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Publication No.: US5982166APublication Date: 1999-11-09
- Inventor: Karl Emerson Mautz
- Applicant: Karl Emerson Mautz
- Applicant Address: IL Schaumburg
- Assignee: Motorola, Inc.
- Current Assignee: Motorola, Inc.
- Current Assignee Address: IL Schaumburg
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H01L21/68 ; G01R31/02
Abstract:
The time required to make test measurements across a large diameter wafer, such as a 300 mm wafer, is reduced by using a wafer measuring system that employs theta (.theta.) and radial (r) control instead of X-Y control. In one embodiment, a measurement arm (14) having a measurement head (16) is positioned over a wafer chuck (18) and a wafer (12) is placed onto the wafer chuck (18). The wafer (12) is then moved to one or more measuring points below the measurement head (16) via theta rotation (.theta.) and radial positioning. A measurement is then taken at the selected location.
Public/Granted literature
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