An apparatus and method are presented for non-contact manipulation of a semiconductor die during semiconductor device manufacturing. Multiple die manipulation circuits are formed within specific regions of die areas of a semiconductor wafer. The die manipulation circuits may be formed upon a frontside surface of the wafer or upon a backside surface of the wafer. Following separation of the semiconductor dice from the wafer, a die is positioned above a horizontal surface of a die manipulation apparatus. Each die manipulation circuit receives alternating current (a.c.) power via an alternating magnetic field and uses the a.c. power to produce a static magnetic field. The static magnetic field opposes static magnetic fields formed around one or more levitation coils of the horizontal surface, causing the die to be levitated above the horizontal surface. By varying the relative strengths of the magnetic fields created by the levitation coils, "waves" of magnetic flux may be formed. Such waves of magnetic flux may be used to move the die parallel to the horizontal surface, or to rotate the die in a horizontal plane about an axis normal to the horizontal surface. Each die manipulation circuit includes a pickup coil, a levitation coil, a rectifier, and a capacitor. The horizontal surface of the die manipulation apparatus includes transmitter coils in addition to levitation coils. Each transmitter coil receives a.c. electrical power and produces an alternating magnetic field in response to the a.c. electrical power.