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公开(公告)号：US08180587B2
公开(公告)日：2012-05-15
申请号：US10094550
申请日：2002-03-08
CPC分类号： G05B23/0213 , G05B23/027
摘要： A method of brokering information in a manufacturing system which includes a broker coupled between a supplier of information and a consumer of information. The manufacturing system receives information from the supplier in a first format and sends information from the broker to the consumer in a second format.
摘要翻译： 一种在制造系统中经纪交易信息的方法，其包括耦合在信息供应者和信息消费者之间的经纪人。 制造系统以第一格式从供应商处接收信息，并以第二种格式将信息从代理发送给消费者。
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公开(公告)号：US07200779B1
公开(公告)日：2007-04-03
申请号：US10133097
申请日：2002-04-26
IPC分类号： G06F11/00
CPC分类号： G06F11/0769 , G06F11/0709 , G06F11/076 , G06F11/0781
摘要： A method and apparatus is provided for fault notification based on a severity level. The method comprises detecting a fault associated with a processing tool that is adapted to process one or more workpieces, determining a fault severity level of the detected fault and selecting at least one user to notify of the fault based on the severity level of the fault.
摘要翻译： 基于严重性级别提供了用于故障通知的方法和装置。 该方法包括检测与处理一个或多个工件的处理工具相关联的故障，确定检测到的故障的故障严重性级别，并且基于故障的严重性级别选择至少一个用户通知故障。
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公开(公告)号：US07051250B1
公开(公告)日：2006-05-23
申请号：US10164091
申请日：2002-06-06
IPC分类号： G06F11/00
CPC分类号： G05B19/4184 , G05B2219/31355 , G05B2219/31365 , G05B2219/32243 , G05B2219/32254 , Y02P90/14 , Y02P90/20
摘要： A method and apparatus is provided for routing workpieces based upon detecting a fault. The method comprises routing a workpiece to a first processing tool identified by a dispatch system, detecting a fault condition associated with the first processing tool and notifying the dispatch system of the detected fault condition. The method further comprises routing a second workpiece to a second processing tool in response to the dispatch system being notified of the fault condition.
摘要翻译： 提供了一种基于检测故障来路由工件的方法和装置。 该方法包括将工件路由到由调度系统识别的第一处理工具，检测与第一处理工具相关联的故障状况并通知调度系统检测到的故障状况。 该方法还包括响应于调度系统被通知故障状况而将第二工件路由到第二处理工具。
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公开(公告)号：US06928333B1
公开(公告)日：2005-08-09
申请号：US09387174
申请日：1999-08-31
摘要： According to an example embodiment, the present invention is directed to a new and efficient method for bringing at least two items together from independent locations via separate paths in a computer controlled manufacturing environment. Using the computer, the probabilities for pickup and delivery of each of the two items are generated and used to determine an efficient manner in which to bring the items together via the separate paths.
摘要翻译： 根据示例性实施例，本发明涉及一种用于在计算机控制的制造环境中通过独立路径将独立位置带入至少两个项目的新的和有效的方法。 使用计算机，产生并且使用两个项目中的每一个的拾取和递送的概率来确定通过分开的路径将项目合在一起的有效方式。
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5.发明授权Method for requesting trace data reports from FDC semiconductor fabrication processes 失效从FDC半导体制造工艺请求跟踪数据报告的方法公开(公告)号：US06871112B1
公开(公告)日：2005-03-22
申请号：US09479852
申请日：2000-01-07
CPC分类号： H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： The invention is, in its various aspects, a method and apparatus for dynamically generating trace data reports in a semiconductor fabrication process employing fault detection control. The method comprises specifying data including at least one of a parameter, a trigger, and a frequency, for a trace data report; automatically generating from a fault detection controller a request including the specified data to a report generator; formulating the trace data report responsive to the request; and returning the formulated trace data report from the report generator based on the request. The apparatus is a semiconductor fabrication processing system, comprising: a fabrication tool capable of providing at least one of specified data and a trace data report; a fault detection controller capable of automatically generating a request for the trace data report, the request including the specified data; a report generator capable of requesting at least one of the specified data and the trace data report from the fabrication tool and capable of, if the specified data is requested from the fabrication tool, providing the trace data report; and an operator interface for receiving data specified for the trace data report, the specified data including at least one of a parameter, a trigger, and a frequency for the trace data report, and to which the trace data report may be returned from at least one of the report generator and the fabrication tool.
摘要翻译： 本发明在其各个方面是一种用于在采用故障检测控制的半导体制造过程中动态产生跟踪数据报告的方法和装置。 该方法包括指定用于跟踪数据报告的包括参数，触发和频率中的至少一个的数据; 从故障检测控制器自动生成包括指定数据的请求到报告生成器; 根据请求制定跟踪数据报告; 并根据请求从报告生成器返回已制定的跟踪数据报告。 该装置是半导体制造处理系统，包括：能够提供指定数据和跟踪数据报告中的至少一个的制造工具; 一个故障检测控制器，能够自动产生跟踪数据报告的请求，该请求包括指定的数据; 报告发生器，其能够从所述制造工具请求所述指定数据和跟踪数据报告中的至少一个，并且如果从所述制造工具请求指定的数据，则能够提供所述跟踪数据报告; 以及用于接收为跟踪数据报告指定的数据的操作者界面，所述指定数据包括用于跟踪数据报告的参数，触发和频率中的至少一个，并且跟踪数据报告至少可以从其返回 报告生成器和制作工具之一。
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公开(公告)号：US6035245A
公开(公告)日：2000-03-07
申请号：US46854
申请日：1998-03-24
CPC分类号： G06Q10/08 , Y10S414/14
摘要： A computer controlled manufacturing arrangement and method for selecting between multiple paths for transporting cassettes between processing locations. The manufacturing arrangement includes a plurality of stockers interconnected with tracks on which cassettes are carried on vehicles. A first and second stocker are interconnected by at least a first path and a second path formed by the tracks, and a cassette can be transported from the first to the second stocker via either of the two paths. A plurality of robotic arrangements are configured to transfer cassettes between the stockers and the vehicles. A data processing system is coupled to the robotic arrangements and configured and arranged to maintain an historical record of codes indicative of periods of time expended in transporting cassettes from the first stocker to the second stocker via the first path and second path, respectively. When a cassette is to be transported from the first stocker to the second stocker, the data processing system determines, as a function of the historical record of codes associated with the paths, which of the first or second paths is more likely to result in a lesser period of time in transporting the cassette, and selects one of the first or second paths according to which path is more likely to result in a lesser period of time in transporting the cassette. The robotic arrangement is then instructed to load the cassette on the vehicle of the selected path.
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公开(公告)号：US5455894A
公开(公告)日：1995-10-03
申请号：US50575
申请日：1993-04-19
CPC分类号： H01L21/67276 , B25J9/1679 , H01L21/67769 , G05B2219/34291 , G05B2219/37558 , G05B2219/45026 , G05B2219/45063 , Y10S414/137 , Y10S706/912
摘要： An improved wafer transfer and monitoring system is described which utilizes a robotic interface unit. The robotic interface unit includes at least one wafer storage location placed proximate to a wafer stepper unit. A robotic arm attached to the interface unit is moveable in three dimensions to move wafers between the wafer storage location and the wafer stepper unit. The robotic interface unit can be placed between a wafer stepper unit and a coater/developer unit to transfer wafers between each unit and to store and monitor wafers placed upon the units and/or upon the wafer storage location. Accordingly, the robotic interface unit can operate in a stand-alone configuration with the wafer stepper or can be integrated between a wafer stepper and a wafer coater/developer. By using a robotic arm, less contaminates are associated with the exposed and readily cleaned arm. As such, the robotic interface unit and integrated system can be used in class I wafer fabrication areas where cleanliness is important, and the ability to track and monitor wafers is also important.
摘要翻译： 描述了利用机器人接口单元的改进的晶片转移和监测系统。 机器人接口单元包括靠近晶片步进单元放置的至少一个晶片存储位置。 附接到接口单元的机械臂可以在三维上移动以在晶片存储位置和晶片步进单元之间移动晶片。 机器人接口单元可以放置在晶片步进单元和涂布机/显影单元之间，以在每个单元之间传送晶片，并且存储和监视放置在单元上和/或晶片存储位置的晶片。 因此，机器人接口单元可以与晶片步进器一起工作在独立结构中，或者可以集成在晶片步进器和晶片涂布机/显影剂之间。 通过使用机器人手臂，较少的污染物与暴露且容易清洁的手臂相关联。 因此，机器人接口单元和集成系统可用于清洁度重要的I类晶圆制造领域，并且跟踪和监视晶片的能力也很重要。
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公开(公告)号：US06895295B1
公开(公告)日：2005-05-17
申请号：US10140468
申请日：2002-05-06
CPC分类号： G03F7/70525 , G03F7/70991
摘要： A method for controlling a processing tool having a plurality of chambers includes processing a wafer in a first chamber of the processing tool; measuring a characteristic of the wafer; and modifying an operating recipe of one of the plurality of chambers based on the measured characteristic. A system for processing semiconductor wafers includes a processing tool, a metrology tool, and a process controller. The processing tool includes a plurality of chambers. The metrology tool is adapted to measure a characteristic of a wafer processed in a first chamber of the processing tool. The process controller is adapted to modify an operating recipe of one of the plurality of chambers based on the measured characteristic.
摘要翻译： 一种用于控制具有多个室的处理工具的方法包括：处理工具的第一室中的晶片; 测量晶片的特性; 以及基于所测量的特性修改所述多个室中的一个室的操作配方。 一种用于处理半导体晶片的系统包括处理工具，计量工具和过程控制器。 处理工具包括多个室。 测量工具适于测量在处理工具的第一室中处理的晶片的特性。 过程控制器适于基于测量的特性来修改多个腔室中的一个腔室的操作配方。
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公开(公告)号：US06878895B1
公开(公告)日：2005-04-12
申请号：US09383508
申请日：1999-08-26
IPC分类号： B07C5/344
CPC分类号： B07C5/344 , Y10S209/939
摘要： A reticle sorter and a semiconductor fabrication facility employing one or more reticle sorters is provided. The reticle sorter(s) generally lies between a reticle storage system and a group of one or more photolithography exposure tools (e.g., steppers) and is configured for sorting reticles in one or more cassettes. The use of the reticle sorter provides sorting functionality apart from the reticle storage system and typically closer to the group of photolithography steppers with which it is associated. This can, for example, significantly increase the throughput of semiconductor wafers through the associated photolithography exposure tools as well as in the semiconductor fabrication plant as a whole.
摘要翻译： 提供了采用一个或多个掩模版分拣机的掩模版分拣机和半导体制造设备。 掩模版分选机通常位于掩模版存储系统和一组一个或多个光刻曝光工具（例如步进器）之间，并且被配置用于将一个或多个盒中的掩模版分类。 标线分类器的使用提供了除了掩模版存储系统之外的分类功能，并且通常更接近与其相关联的光刻步进组。 例如，这可以通过相关的光刻曝光工具以及整个半导体制造工厂显着提高半导体晶片的生产量。
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10.发明授权Method for determining, tracking and/or controlling processing based upon silicon characteristics 有权用于基于硅特性确定，跟踪和/或控制处理的方法公开(公告)号：US06638778B1
公开(公告)日：2003-10-28
申请号：US10082809
申请日：2002-02-25
IPC分类号： H01L2166
CPC分类号： H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： The present invention is generally directed to various methods for determining, tracking and/or controlling processing based upon wafer characteristics. In one embodiment, the method is directed to selecting a plurality of wafers from the group of wafers based upon the semiconductor device to be manufactured on the wafer and at least one characteristic of the wafers. In another embodiment, the method comprises identifying a source of wafers wherein the device metrology data lies outside of the preselected range based upon the wafer identification mark and the device metrology data. As yet another example, the method comprises determining at least one parameter of a process operation to be performed on a wafer in a processing tool based upon the determined wafer characteristics.
摘要翻译： 本发明一般涉及用于基于晶片特性来确定，跟踪和/或控制处理的各种方法。 在一个实施例中，该方法旨在基于要在晶片上制造的半导体器件和晶片的至少一个特性从晶片组中选择多个晶片。 在另一个实施例中，该方法包括识别晶片源，其中基于晶片识别标记和器件测量数据，器件测量数据位于预选范围之外。 作为另一示例，该方法包括基于所确定的晶片特性来确定在处理工具中在晶片上执行的处理操作的至少一个参数。
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