A semiconductor package inspection apparatus which varies the emission spectrum of an oblique imaging illumination and a plan view imaging illumination from each other, and which comprises a first filter which is provided on the optical path from a semiconductor package to an oblique imaging device, and which passes light from the oblique imaging illumination and blocks light from the plan view imaging illumination; a second filter which is provided on the optical path from a semiconductor package to the plan view imaging device, and which passes light from the plan view imaging illumination and blocks light from the oblique imaging illumination; and a control unit which simultaneously turns on the oblique imaging and plan view imaging illumination, and inspects terminals of the semiconductor package based on image data of the oblique imaging device and plan view imaging device.