An interconnection mechanism (1) for electrically connecting circuit paths (2) on respective flexible printed circuits (3) has clamping jaws (4, 5) to clamp a stack (6) of overlapped flexible printed circuits (3) that are in fixed registration on said mechanism (1), the clamping jaws (4, 5) having directly opposed, raised surfaces (14, 15) forcing said circuit paths (2) between the surfaces (14, 15) to engage at multiple spaced locations.