发明授权
- 专利标题: Electrical connecting apparatus for electrically connecting a device to be tested
- 专利标题(中): 电气连接装置
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申请号: US115573申请日: 1998-07-14
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公开(公告)号: US6019612A公开(公告)日: 2000-02-01
- 发明人: Yoshiei Hasegawa , Eichi Osato
- 申请人: Yoshiei Hasegawa , Eichi Osato
- 申请人地址: JPX Tokyo
- 专利权人: Kabushiki Kaisha Nihon Micronics
- 当前专利权人: Kabushiki Kaisha Nihon Micronics
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX9-39734 19970210; JPX9-139100 19970515
- 主分类号: H01R13/24
- IPC分类号: H01R13/24 ; H05K7/10 ; H01R9/09
摘要:
The connecting apparatus has a plurality of probes, each having a deformed portion, a needle front portion with a tip end to be pressed against an electrode portion of a device to be tested and continuous with the deformed portion, and a needle tail portion continuous with the other end portion of the deformed portion, assembled in parallel into a base plate by assembling equipment with the tail end portions brought into contact with a retraction preventive portion. Thereby, when device to be tested is pressed against the probe, the probe is prevented from retracting according to the curved state of the deformed portion.
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