Disclosed is an electrical connector in which the contacts are fused to a solder ball conductive material which are reflowed to provide a primary electrical current path between the connection and a substrate. Also disclosed is a method for fusing the conductive element to the contacts of the connector. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side of the conductor element into the recess on the exterior side of the housing. A conductive element which will ordinarily be a solder ball is positioned in the recess on the exterior side of the housing. The metallic element emplaced in the recess is then heated to a temperature sufficient to soften the metallic element and fuse the metallic element to the contact extending into said recess.