Invention Grant
US6038764A Method of distributing a wire harness to a wall surface by detachably
locking the wire harness on a trimming plate
失效
通过将线束可拆卸地锁定在修整板上将线束分配到墙壁表面的方法
- Patent Title: Method of distributing a wire harness to a wall surface by detachably locking the wire harness on a trimming plate
- Patent Title (中): 通过将线束可拆卸地锁定在修整板上将线束分配到墙壁表面的方法
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Application No.: US880871Application Date: 1997-06-23
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Publication No.: US6038764APublication Date: 2000-03-21
- Inventor: Atsuyoshi Yamaguchi , Minoru Kubota
- Applicant: Atsuyoshi Yamaguchi , Minoru Kubota
- Applicant Address: JPX Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JPX Tokyo
- Priority: JPX8-163442 19960624
- Main IPC: B60R16/02
- IPC: B60R16/02 ; B60J5/04 ; B60R13/02 ; H01B13/012 ; H01R9/16 ; H01R43/28 ; H01R43/00
Abstract:
A wire harness distributing method in which a wire harness is easily distributed with the aid of a trimming plate which is mounted to a wall surface such as a vehicle body panel, and once the trimming plate is mounted, even if the trimming plate is removed, all or part of the wire harness remains on the wall surface for easy maintenance. The method of distributing a wire harness with connectors to a wall surface such as a vehicle body panel includes the steps of: providing a first preliminary locking member for a wire harness on a trimming plate which is to be mounted to a wall surface; providing a second preliminary locking member to the wire harness, and detachably and preliminarily locking the wire harness to the trimming plate; and fixing the trimming plate and the wire harness to the wall surface.
Public/Granted literature
- US5239193A Silicon photodiode for monolithic integrated circuits Public/Granted day:1993-08-24
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