A composite wafer carrier for holding and restraining circular semiconductor wafer disks during their transport, storage, and processing. The composite wafer carrier generally comprising an open top and bottom for insertion and removal of wafer disk, an upright front end member having an interface portion such as an H-bar, an upright back end member, and a pair of sidewall members with vertical sidewall slots extending rearwardly from the front end member to said back end member. At least one of said members separately molded and joined to the other members of the wafer carrier by cooperating engagement portions without external fasteners. The wafer carrier may be snapped together. A separate second interface at the back end member may be provided to allow the carrier to interface with equipment with the wafer top side up or inverted. The separately formed members permit different materials to be used or the same basic material with different formulations for example, for differing static dissapative characteristics.