公开(公告)号：US07168587B2

公开(公告)日：2007-01-30

申请号：US11109494

申请日：2005-04-19

申请人： Shawn D. Eggum

发明人： Shawn D. Eggum

IPC分类号： B65D45/28

CPC分类号： H01L21/67373 ,  Y10T292/0908

摘要： A wafer container with a door, the door has at least one latching mechanism, wherein the latching mechanism has a spring member that holds the latching mechanism at one or more desired positions that preferably correspond to latch-open and latch-closed conditions. In a preferred embodiment, the spring member has an over-center condition that urges the latching mechanism towards the favored positions, thereby resisting unintended actuation of the latching mechanism. Moreover, in preferred embodiments, the latching mechanism has soft stops at the latch open or latch closed condition that minimizes abrupt snapping into position of the latching mechanism. Preferred embodiments utilize a rotatable member configured as a cammed member with an elongate rigid plastic member having at least one node, forming a plastic spring. The spring is pivotally mounted on the rotatable member and pivotally mounted to the door structure.

摘要翻译： 具有门的晶片容器，门具有至少一个闭锁机构，其中闩锁机构具有弹簧构件，该弹簧构件将闭锁机构保持在优选地对应于闩锁开启和闭锁状态的一个或多个期望位置。 在优选实施例中，弹簧构件具有过中心状态，其将锁定机构朝向有利位置推动，由此抵抗闩锁机构的非预期动作。 此外，在优选实施例中，闩锁机构在闩锁打开或闩锁关闭状态下具有软停止，以使突然卡入到锁定机构的位置。 优选实施例利用构造为具有至少一个节点的细长刚性塑料构件作为凸轮构件的可旋转构件，形成塑料弹簧。 弹簧可枢转地安装在可旋转构件上，并可枢转地安装在门结构上。

公开(公告)号：US06955382B2

公开(公告)日：2005-10-18

申请号：US10317023

申请日：2002-12-11

申请人： Shawn D. Eggum

发明人： Shawn D. Eggum

IPC分类号： B65D85/86 ,  E05C9/04 ,  H01L21/673 ,  E05C1/06

CPC分类号： H01L21/67373 ,  E05C9/043 ,  E05C9/047 ,  Y10S292/11 ,  Y10S292/12 ,  Y10T292/0837 ,  Y10T292/0839 ,  Y10T292/084 ,  Y10T292/0851 ,  Y10T292/0921 ,  Y10T292/0947 ,  Y10T292/0964 ,  Y10T292/1016 ,  Y10T292/202 ,  Y10T292/225

摘要： A wafer container, and methods of constructing a wafer container. The wafer container has an enclosure portion with at least a top, a bottom, a pair of opposing sides, a back, an open front, and a door to close the open front. The door includes a door chassis with at least a first latching mechanism. The latching mechanism has a rotatable cam member and at least one latching arm. The latching arm has a bifurcate cam follower portion that engages with the periphery of the cam member.

摘要翻译： 晶片容器，以及构造晶片容器的方法。 晶片容器具有至少具有顶部，底部，一对相对侧的外壳部分，后部，敞开的前部和门，以闭合开放的前部。 该门包括具有至少第一闭锁机构的门底盘。 闩锁机构具有可旋转的凸轮构件和至少一个闭锁臂。 闩锁臂具有与凸轮构件的周边接合的分叉凸轮从动部分。

公开(公告)号：US6039186A

公开(公告)日：2000-03-21

申请号：US58137

申请日：1998-04-10

申请人： Sanjiv M. Bhatt ,  Shawn D. Eggum ,  Wayne C. Olson

发明人： Sanjiv M. Bhatt ,  Shawn D. Eggum ,  Wayne C. Olson

IPC分类号： B65D85/86 ,  H01L21/673 ,  B65D85/90

CPC分类号： H01L21/67326 ,  H01L21/6732 ,  Y10S206/832

摘要： A composite wafer carrier for holding and restraining circular semiconductor wafer disks during their transport, storage, and processing. The composite wafer carrier generally comprising an open top and bottom for insertion and removal of wafer disk, an upright front end member having an interface portion such as an H-bar, an upright back end member, and a pair of sidewall members with vertical sidewall slots extending rearwardly from the front end member to said back end member. At least one of said members separately molded and joined to the other members of the wafer carrier by cooperating engagement portions without external fasteners. The wafer carrier may be snapped together. A separate second interface at the back end member may be provided to allow the carrier to interface with equipment with the wafer top side up or inverted. The separately formed members permit different materials to be used or the same basic material with different formulations for example, for differing static dissapative characteristics.

摘要翻译： 一种复合晶片载体，用于在运输，储存和加工期间保持和限制圆形半导体晶片盘。 复合晶片载体通常包括用于插入和移除晶片盘的开放顶部和底部，具有接口部分的竖直前端构件，例如H形杆，竖直后端构件和具有垂直侧壁的一对侧壁构件 槽从前端构件向后延伸到所述后端构件。 至少一个所述构件通过配合的接合部分分开地模制并接合到晶片载体的其它构件，而没有外部紧固件。 晶片载体可以卡在一起。 可以提供在后端构件处的单独的第二接口，以允许载体与晶片顶面向上或倒置的设备接合。 单独形成的构件允许使用不同的材料或具有不同制剂的相同的基础材料，例如用于不同的静态剥离特性。

公开(公告)号：US06871741B2

公开(公告)日：2005-03-29

申请号：US10213282

申请日：2002-08-05

申请人： Sanjiv M. Bhatt ,  Shawn D. Eggum

发明人： Sanjiv M. Bhatt ,  Shawn D. Eggum

IPC分类号： B29C45/14 ,  B29C45/16 ,  B29K69/00 ,  B29K73/00 ,  B29K79/00 ,  G03F7/20 ,  H01L21/673 ,  B65D85/48

CPC分类号： B29C45/0003 ,  B29C45/16 ,  B29K2995/0087 ,  B29L2031/16 ,  G03F7/70691 ,  G03F7/708 ,  H01L21/67313 ,  H01L21/6732 ,  H01L21/67326 ,  H01L21/67366 ,  H01L21/67373 ,  H01L21/67383

摘要： A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

摘要翻译： 根据本发明实施例的复合晶片载体包括由第一热塑性材料形成的操作部分和由第二不同热塑性材料形成的支撑部分。 其中一个操作部分和支撑部分被包覆模制在另一个上，以形成将这些部分牢固地结合在一起的无间隙的密封界面。 操作部分可以是透明窗口，闩锁机构的一部分或晶片接触部分。 本发明的优选实施例包括具有所述特征的晶片载体，具有所述特征的工艺载体和用于制造具有所述特征的晶片载体的工艺。

公开(公告)号：US06712213B2

公开(公告)日：2004-03-30

申请号：US10307894

申请日：2002-12-02

申请人： Shawn D. Eggum

发明人： Shawn D. Eggum

IPC分类号： B65D8590

CPC分类号： H01L21/67373

摘要： A door for a wafer carrier having a latching mechanism with a rotatable actuating member. The rotatable actuating member is actuated from outside the wafer carrier using a key inserted into a key slot in the rotatable actuating member. The key slot is formed in an hourglass shape and comprised of abrasion resistant material to reduce generation of particulate contaminants.

摘要翻译： 一种用于晶片载体的门，其具有带有可旋转致动构件的闩锁机构。 可旋转致动构件使用插入到可旋转致动构件中的键槽中的键从晶片载体的外部致动。 钥匙槽形成沙漏形状，由耐磨材料组成，以减少颗粒污染物的产生。

公开(公告)号：US20120061288A1

公开(公告)日：2012-03-15

申请号：US13301422

申请日：2011-11-21

申请人： Sanjiv M. BHATT ,  Shawn D. EGGUM

发明人： Sanjiv M. BHATT ,  Shawn D. EGGUM

IPC分类号： H01L21/673 ,  B28B5/00

CPC分类号： B29C45/0003 ,  B29C45/16 ,  B29K2995/0087 ,  B29L2031/16 ,  G03F7/70691 ,  G03F7/708 ,  H01L21/67313 ,  H01L21/6732 ,  H01L21/67326 ,  H01L21/67366 ,  H01L21/67373 ,  H01L21/67383

摘要： A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

摘要翻译： 根据本发明实施例的复合晶片载体包括由第一热塑性材料形成的操作部分和由第二不同热塑性材料形成的支撑部分。 其中一个操作部分和支撑部分被包覆模制在另一个上，以形成将这些部分牢固地结合在一起的无间隙的密封界面。 操作部分可以是透明窗口，闩锁机构的一部分或晶片接触部分。 本发明的优选实施例包括具有所述特征的晶片载体，具有所述特征的工艺载体和用于制造具有所述特征的晶片载体的工艺。

公开(公告)号：US06428729B1

公开(公告)日：2002-08-06

申请号：US09317989

申请日：1999-05-25

申请人： Sanjiv M. Bhatt ,  Shawn D. Eggum

发明人： Sanjiv M. Bhatt ,  Shawn D. Eggum

IPC分类号： B29C4514

CPC分类号： H01L21/67383 ,  B29C45/16 ,  B29K2995/0087 ,  B29L2031/16 ,  G03F7/70691 ,  G03F7/708

摘要： A wafer carrier is formed from at least two different melt processable plastic materials in which the two plastic materials are strategically positioned for optimal performance and have a thermophysical bond created during an overmolding process. The invention includes carriers made of such different melt processable plastic materials and includes the process for manufacturing such carriers. In a preferred embodiment a H-bar wafer carrier will have a first structural portion molded of polycarbonate in a first mold cavity and will then have the polycarbonate molded portion placed in a second mold cavity and polyetheretherketone will be injection molded to form wafer contact portions on the H-bar carrier. Process temperatures and mold temperatures are controlled to provide optimal bonding between the dissimilar materials. Thus, an integral wafer carrier of composite materials is formed. An additional embodiment utilizes components such as shelves or sidewall inserts for holding wafers molded of two dissimilar plastics and said components are assembled within a disk enclosure such as a transport module.

摘要翻译： 晶片载体由至少两种不同的可熔融加工塑料材料形成，其中两种塑料材料在策略上定位以获得最佳性能，并且在包覆成型工艺期间产生热物理粘结。 本发明包括由这种不同的可熔融加工塑料材料制成的载体，并且包括制造这种载体的方法。 在优选实施例中，H型棒状晶片载体将具有在第一模腔中由聚碳酸酯模制的第一结构部分，然后将聚碳酸酯模制部分放置在第二模腔中，并且聚醚醚酮将被注塑成型以形成晶片接触部分 H型杆载体。 控制工艺温度和模具温度以提供不同材料之间的最佳粘合。 因此，形成复合材料的整体晶片载体。 另外的实施例使用诸如搁架或侧壁插入件的部件来保持由两个不同塑料模制的晶片，并且所述部件组装在诸如传输模块的盘壳体内。

公开(公告)号：US07168564B2

公开(公告)日：2007-01-30

申请号：US11092528

申请日：2005-03-29

申请人： Sanjiv M. Bhatt ,  Shawn D. Eggum

发明人： Sanjiv M. Bhatt ,  Shawn D. Eggum

IPC分类号： B65D85/48

CPC分类号： B29C45/0003 ,  B29C45/16 ,  B29K2995/0087 ,  B29L2031/16 ,  G03F7/70691 ,  G03F7/708 ,  H01L21/67313 ,  H01L21/6732 ,  H01L21/67326 ,  H01L21/67366 ,  H01L21/67373 ,  H01L21/67383

摘要： A composite wafer carrier according to an embodiment of the present invention comprises an operative portion formed of a first thermoplastic material and a support portion formed of a second different thermoplastic material. One of the operative portion and support portion is overmolded onto the other to form a gapless hermitic interface that securely bonds the portions together. The operative portion may be a transparent window, a portion of a latching mechanism or a wafer contact portion. Preferred embodiments of the invention include wafer carriers with said features, process carriers with said features and a process for manufacturing wafer carriers with said features.

摘要翻译： 根据本发明实施例的复合晶片载体包括由第一热塑性材料形成的操作部分和由第二不同热塑性材料形成的支撑部分。 其中一个操作部分和支撑部分被包覆模制在另一个上，以形成将这些部分牢固地结合在一起的无间隙的密封界面。 操作部分可以是透明窗口，闩锁机构的一部分或晶片接触部分。 本发明的优选实施例包括具有所述特征的晶片载体，具有所述特征的工艺载体和用于制造具有所述特征的晶片载体的工艺。

公开(公告)号：US07131176B2

公开(公告)日：2006-11-07

申请号：US10979780

申请日：2004-11-02

申请人： Shawn D. Eggum

发明人： Shawn D. Eggum

IPC分类号： B23P11/00 ,  B65D85/48

CPC分类号： H01L21/67383 ,  Y10S414/135 ,  Y10T29/4984 ,  Y10T29/49844 ,  Y10T29/49998

摘要： A wafer container for supporting semi-conductor wafer disks and for interfacing with processing equipment and methods for constructing the same. Wafer supports are positioned within an enclosure portion, the wafer supports having a plurality of vertically stacked shelves for defining slots. The wafer supports are secured within the enclosure portion rigidly at the bottom margin and resiliently at the top margin. In preferred embodiments resilient plastic spring members extend between the closed top and the wafer supports to substantially constrain lateral or forward-back movement of the wafer supports with respect to the closed top and to permit some vertical movement of the wafer support with respect to the closed top. The spring members may be configured as a leaf spring integral with an extending from the top margin of each wafer support.

公开(公告)号：US06880718B2

公开(公告)日：2005-04-19

申请号：US10318374

申请日：2002-12-11

申请人： Shawn D. Eggum

发明人： Shawn D. Eggum

IPC分类号： B65D45/28 ,  H01L21/673

CPC分类号： H01L21/67373 ,  Y10T292/0908

摘要： A wafer container having a door with at least one latching mechanism, wherein the latching mechanism has a spring member that holds the latching mechanism at one or more favored positions that preferably correspond to latch-open and latch-closed conditions. In a preferred embodiment, the spring member has an over-center condition that urges the latching mechanism towards the favored positions, thereby resisting unintended actuation of the latching mechanism. Moreover, in preferred embodiments, the latching mechanism has soft stops at the latch open or latch closed condition that minimizes abrupt snapping into position of the latching mechanism. Preferred embodiments utilize a rotatable member configured as a cammed member with an elongate rigid plastic member having at least one node, forming a plastic spring. The spring is pivotally mounted on the rotatable member and pivotally mounted to the door structure.

摘要翻译： 一种具有具有至少一个闭锁机构的门的晶片容器，其中所述闩锁机构具有弹簧构件，所述弹簧构件将所述闩锁机构保持在优选对应于闩锁开启和闭锁状态的一个或多个有利位置。 在优选实施例中，弹簧构件具有过中心状态，其将锁定机构朝向有利位置推动，由此抵抗闩锁机构的非预期动作。 此外，在优选实施例中，闩锁机构在闩锁打开或闩锁关闭状态下具有软停止，以使突然卡入到锁定机构的位置。 优选实施例利用构造为具有至少一个节点的细长刚性塑料构件作为凸轮构件的可旋转构件，形成塑料弹簧。 弹簧可枢转地安装在可旋转构件上，并可枢转地安装在门结构上。