发明授权
- 专利标题： Hard coated copper alloys
- 专利标题（中）： 硬涂层铜合金
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申请号： US890387申请日： 1997-07-09
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公开(公告)号： US6040067A公开(公告)日： 2000-03-21
- 发明人: Akira Sugawara , Yoshitake Hana , Takayoshi Endo , Osamu Sugiyama
- 申请人： Akira Sugawara , Yoshitake Hana , Takayoshi Endo , Osamu Sugiyama
- 申请人地址： JPX Tokyo JPX Tokyo
- 专利权人： Dowa Mining Co., Ltd.,Yazaki Corporation
- 当前专利权人： Dowa Mining Co., Ltd.,Yazaki Corporation
- 当前专利权人地址： JPX Tokyo JPX Tokyo
- 优先权： JPX8-201077 19960711
- 主分类号： C23C10/20
- IPC分类号： C23C10/20 ; B32B15/01 ; C22C9/02 ; C22C9/04 ; C23C10/28 ; C23C28/02 ; C25D3/30 ; C25D5/50 ; B32B5/16 ; B32B15/20
摘要：
The invention provides a coated Cu alloy and a process for producing the coated Cu alloy having a surface which has a low coefficient of friction and a high resistance to abrasion and is suitable for fabricating connectors, charging-sockets of electric automobiles etc. The coated Cu alloy is produced by coating the surface of a copper alloy with Sn and heat treating the coated Cu alloy at a temperature in the range of 100-450.degree. C. for 0.5-24 hours. The Cu alloy which is coated with Sn consists of 1-41 wt % Zn with the balance being Cu and incidental impurities. By using the coated Cu alloy, the force of insertion, resistance to abrasion and resistance to corrosion of connectors can be significantly improved.
公开/授权文献
- USPP6271P Carnation variety `Londibis` 公开/授权日：1988-09-06
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