公开(公告)号：US6040067A

公开(公告)日：2000-03-21

申请号：US890387

申请日：1997-07-09

申请人： Akira Sugawara ,  Yoshitake Hana ,  Takayoshi Endo ,  Osamu Sugiyama

发明人： Akira Sugawara ,  Yoshitake Hana ,  Takayoshi Endo ,  Osamu Sugiyama

IPC分类号： C23C10/20 ,  B32B15/01 ,  C22C9/02 ,  C22C9/04 ,  C23C10/28 ,  C23C28/02 ,  C25D3/30 ,  C25D5/50 ,  B32B5/16 ,  B32B15/20

CPC分类号： C25D5/505 ,  B32B15/01 ,  C22C9/02 ,  C22C9/04 ,  C25D3/30 ,  Y10T428/12715 ,  Y10T428/12903 ,  Y10T428/265

摘要： The invention provides a coated Cu alloy and a process for producing the coated Cu alloy having a surface which has a low coefficient of friction and a high resistance to abrasion and is suitable for fabricating connectors, charging-sockets of electric automobiles etc. The coated Cu alloy is produced by coating the surface of a copper alloy with Sn and heat treating the coated Cu alloy at a temperature in the range of 100-450.degree. C. for 0.5-24 hours. The Cu alloy which is coated with Sn consists of 1-41 wt % Zn with the balance being Cu and incidental impurities. By using the coated Cu alloy, the force of insertion, resistance to abrasion and resistance to corrosion of connectors can be significantly improved.

摘要翻译： 本发明提供一种涂覆的Cu合金和一种具有低摩擦系数和高耐磨性的表面的涂覆的Cu合金的方法，并且适用于制造连接器，电动汽车的充电座等。涂覆的Cu 通过用Sn涂覆铜合金表面并在100-450℃的温度范围内对涂覆的Cu合金进行热处理0.5-24小时来制造合金。 涂有Sn的Cu合金由1-41wt％的Zn组成，余量为Cu和杂质。 通过使用涂覆的Cu合金，可以显着提高连接器的插入力，耐磨性和耐腐蚀性。

公开(公告)号：US06180174B2

公开(公告)日：2001-01-30

申请号：US09432675

申请日：1999-11-02

申请人： Akira Sugawara ,  Yoshitake Hana ,  Takayoshi Endo ,  Osamu Sugiyama

发明人： Akira Sugawara ,  Yoshitake Hana ,  Takayoshi Endo ,  Osamu Sugiyama

IPC分类号： B05D302

CPC分类号： C25D5/505 ,  B32B15/01 ,  C22C9/02 ,  C22C9/04 ,  C25D3/30 ,  Y10T428/12715 ,  Y10T428/12903 ,  Y10T428/265

摘要： The invention provides a process for producing a coated Cu alloy having a surface which has a low coefficient of friction and a high resistance to abrasion and is suitable for fabricating connectors, charging-sockets of electric automobiles etc. The coated Cu alloy is produced by coating the surface of a copper alloy with Sn and heat treating the coated Cu alloy at a temperature in the range of 100-450° C. for 0.5-24 hours. The Cu alloy which is coated with Sn consists of 1-41 wt % Zn with the balance being Cu and incidental impurities. By using the coated Cu alloy, the force of insertion, resistance to abrasion and resistance to corrosion of connectors can be significantly improved.

摘要翻译： 本发明提供了一种具有低摩擦系数和高耐磨性的表面的涂覆的Cu合金的制造方法，适用于制造连接器，电动汽车的充电座等。涂覆的Cu合金是通过涂覆 用Sn合金的铜合金的表面，并在100-450℃的温度范围内对涂覆的Cu合金进行热处理0.5-24小时。 涂有Sn的Cu合金由1-41wt％的Zn组成，余量为Cu和杂质。 通过使用涂覆的Cu合金，可以显着提高连接器的插入力，耐磨性和耐腐蚀性。

公开(公告)号：US06312762B1

公开(公告)日：2001-11-06

申请号：US09496697

申请日：2000-02-02

申请人： Akira Sugawara ,  Yoshitake Hana ,  Takayoshi Endo

发明人： Akira Sugawara ,  Yoshitake Hana ,  Takayoshi Endo

IPC分类号： B05D302

CPC分类号： C23C28/322 ,  C22F1/02 ,  C22F1/08 ,  C23C26/00 ,  C23C28/325 ,  C23C28/345 ,  C25D5/505 ,  H01R13/03

摘要： A process for the production of copper or a copper base alloy that provides a surface having improved characteristics suitable for the production of a connector or a charging-socket of an electric automobile by having a decreased coefficient of friction on the surface and improved resistance to abrasion. The process comprises coating copper or a copper alloy with Sn, followed by heat treating the resulting Sn-plated copper or copper base in an atmosphere having an oxygen content of no more than 5%, thereby forming on an outermost surface thereof an oxide film and beneath the surface a layer of an intermetallic compound mainly comprising Cu—Sn.

摘要翻译： 一种制造铜或铜基合金的方法，其通过在表面上具有降低的摩擦系数和改善的耐磨性来提供具有适于生产电动汽车的连接器或充电插座的改善特性的表面 。 该工艺包括用Sn涂覆铜或铜合金，然后在氧含量不超过5％的气氛中热处理所得到的镀Sn的铜或铜基，从而在其最外表面上形成氧化膜， 在表面下方有一层主要包含Cu-Sn的金属间化合物。

公开(公告)号：US06336979B1

公开(公告)日：2002-01-08

申请号：US09493997

申请日：2000-01-27

申请人： Akira Sugawara ,  Yoshitake Hana ,  Takayoshi Endo

发明人： Akira Sugawara ,  Yoshitake Hana ,  Takayoshi Endo

IPC分类号： C23C2600

CPC分类号： C22F1/08 ,  C22F1/02 ,  C23C26/00 ,  C25D5/505 ,  H01R13/03 ,  Y10S428/929 ,  Y10S428/941 ,  Y10T428/1259 ,  Y10T428/12715

摘要： Wear resistant copper or a wear resistant copper base alloy having formed on the outermost surface thereof an oxide layer having a thickness of 10-1000 nm and a layer of an intermetallic compound primarily comprising Cu—Sn having a thickness of 0.1-10 &mgr;m under the oxide film layer is provided; a method of preparing the above-described wear resistant copper or copper base alloy by coating base material copper or a copper base alloy with Sn, preferably performing reflow treatment and then conducting heat treatment is provided; and an electrical part comprising the above-described wear resistant copper or copper base alloy is provided. A terminal made of the alloy according to the present invention which has an appropriate oxide film layer by performing heat treatment can greatly decrease a terminal-insertion force compared with that made of an ordinary copper base alloy which is not subjected to the heat treatment. The wear resistant copper or copper base alloy according to the present invention has a large surface hardness, an excellent slipping property, small contact resistance, an excellent electrical characteristic, as well as the small terminal-insertion force so that it can advantageously be used in an electrical part such as a connector or the like for use in an automobile, a charging socket or the like for use in an electric automobile.

摘要翻译： 耐磨铜或耐磨铜基合金，其最外表面上形成有厚度为10-1000nm的氧化物层和主要包含厚度为0.1-10μm的Cu-Sn的金属间化合物层， 氧化膜层; 提供了通过涂覆基底材料铜或铜基合金与Sn，优选进行回流处理然后进行热处理来制备上述耐磨铜或铜基合金的方法; 并且提供包括上述耐磨铜或铜基合金的电气部件。 与通过不进行热处理的普通铜基合金相比，通过进行热处理具有合适的氧化膜层的本发明的合金端子，能够大大降低端子插入力。 根据本发明的耐磨铜或铜基合金具有大的表面硬度，优异的滑动性，小接触电阻，优异的电特性，以及小的端子插入力，使得其可以有利地用于 用于汽车的电气部件，例如连接器等，用于电动汽车的充电插座等。

公开(公告)号：US06254702B1

公开(公告)日：2001-07-03

申请号：US09379951

申请日：1999-08-24

申请人： Yoshitake Hana ,  Akira Sugawara ,  Takayoshi Endo

发明人： Yoshitake Hana ,  Akira Sugawara ,  Takayoshi Endo

IPC分类号： C22C902

CPC分类号： C22C9/06 ,  C22C9/02

摘要： A copper alloy for terminals of the Cu—Ni—Sn—P system or Cu—Ni—Sn—P—Zn system and that has a tensile strength of at least 500 N/mm2, a spring limit of at least 400 N/mm2, a stress relaxation of no more than 10%, a conductivity of at least 30% IACS and a bending workability in terms of a R/t ratio of no more than 2. The spring portion or the entire part of such terminals are produced from the copper alloy, and have an initial insertion/extraction force of 1.5 N to 30 N and a resistance of no more than 3 m&OHgr; at low voltage and low current as initial performance. The terminals experience not more than 20% stress relaxation. The alloy is superior to the conventional bronze, phosphor bronze and Cu—Sn—Fe—P alloys for terminals in terms of tensile strength, spring limit, stress relaxation characteristics and conductivity and, hence, the terminals manufactured from such alloys have higher performance and reliability than terminals made of the conventional copper alloys for terminals.

摘要翻译： Cu-Ni-Sn-P系或Cu-Ni-Sn-P-Zn系的端子用铜合金，拉伸强度为500N / mm2以上，弹簧极限为400N / mm2以上 ，不小于10％的应力松弛，IACS的至少30％的导电率和不大于2的R / t比的弯曲加工性。这些端子的弹簧部分或整个部分由 铜合金，并且在低电压和低电流下具有1.5N至30N的初始插入/提取力和不超过3mOMEGA的电阻作为初始性能。 终端体验不到20％的压力放松。 在拉伸强度，弹簧极限，应力松弛特性和导电性方面，该合金优于常规的青铜，磷青铜和Cu-Sn-Fe-P合金，因此，由这种合金制造的端子具有更高的性能和 可靠性高于用于端子的常规铜合金制成的端子。

公开(公告)号：US5849424A

公开(公告)日：1998-12-15

申请号：US647812

申请日：1996-05-15

申请人： Akira Sugawara ,  Yoshitake Hana

发明人： Akira Sugawara ,  Yoshitake Hana

IPC分类号： C22F1/08 ,  C23C26/00 ,  C25D5/50 ,  H01R13/03 ,  H01R13/05 ,  B32B15/20

CPC分类号： C22F1/08 ,  C23C26/00 ,  C25D5/505 ,  H01R13/03 ,  H01R13/05 ,  Y10S428/923 ,  Y10S428/926 ,  Y10T428/12903 ,  Y10T428/1291

摘要： A coated Cu alloy having a high hardness surface which contains intermetallic compounds consisting essentially of Cu and Sn is produced by coating the surface of a Cu alloy with Sn and heat treating the coated Cu alloy to form on the surface thereof a high hardness coating containing Cu--Sn intermetallic compound(s). The coated Cu alloy has improved resistance to abrasion and corrosion and good workability, which permits producing terminal connectors therefrom. The Cu alloy which is coated with Sn consists essentially of 0.01-15 wt % Ni, 0.1-10 wt % Sn, 0.005-0.5 wt % P, and optionally 0.01-40 wt % in total of one or two or more elements selected from the group consisting of Fe, Co, Zn, Ti, Mg, Zr, Ca, Si, Mn, Cd, Al, Pb, Be, Te, In, Ag, B, Y, La, Cr, Ce and Au, with the balance being Cu and incidental impurities.

摘要翻译： 通过用Sn涂覆Cu合金的表面并对涂覆的Cu合金进行热处理，在其表面上形成含有Cu的高硬度涂层，制备了具有高硬度表面的包含金属间化合物的涂层Cu合金，其包含基本上由Cu和Sn组成的金属间化合物 -Sn金属间化合物。 涂覆的Cu合金具有改善的耐磨性和耐腐蚀性以及良好的可加工性，这允许从其生产端子连接器。 涂覆有Sn的Cu合金基本上由0.01-15重量％的Ni，0.1-10重量％的Sn，0.005-0.5重量％的P和任选的0.01-40重量％的总计的一种或两种或更多种元素组成， 由Fe，Co，Zn，Ti，Mg，Zr，Ca，Si，Mn，Cd，Al，Pb，Be，Te，In，Ag，B，Y，La，Cr，Ce和Au组成的组， 余量为铜和杂质。