Invention Grant
- Patent Title: Method of improved cavity BGA circuit package
- Patent Title (中): 改进空腔BGA电路封装方法
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Application No.: US238872Application Date: 1999-01-27
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Publication No.: US6040631APublication Date: 2000-03-21
- Inventor: Eric P. Dibble , Eric A. Johnson , Raymond A. Phillips, Jr.
- Applicant: Eric P. Dibble , Eric A. Johnson , Raymond A. Phillips, Jr.
- Applicant Address: NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: NY Armonk
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L21/58 ; H01L23/36 ; H01L23/373 ; H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
An improved bonding system is provided in which a metal heat spreader is bonded to semiconductor chip. A two adhesive system is used in which a first adhesive demonstrates high bond strength with a second adhesive exhibits high thermal conductivity.
Public/Granted literature
- US5392721A Method for recycling papermaking sludge Public/Granted day:1995-02-28
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