Invention Grant
- Patent Title: Hole-forming device
- Patent Title (中): 成孔装置
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Application No.: US199365Application Date: 1998-11-25
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Publication No.: US6041506APublication Date: 2000-03-28
- Inventor: Shin Iwao
- Applicant: Shin Iwao
- Applicant Address: JPX JPX
- Assignee: Shin IWAO,Kabushiki Kaisha Iwazaki
- Current Assignee: Shin IWAO,Kabushiki Kaisha Iwazaki
- Current Assignee Address: JPX JPX
- Priority: JPX10-316547 19981106
- Main IPC: B65D83/14
- IPC: B65D83/14 ; B67B7/48 ; B67C9/00 ; B67B7/24
Abstract:
A hole-forming device includes a pointed shaft which is raisable to a position facing a bottom of a can. The shaft is slidably supported on a support plate, with its lower end projecting downward below the support plate. With the hole-forming device mounted on the bottom of the can, and the bottom of the hole-forming device on a surface, such as a floor, a downward force on the can urges the pointed end of the shaft into the bottom of the can to safely puncture the can.
Public/Granted literature
- US5857644A Homing process Public/Granted day:1999-01-12
Information query
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