发明授权
US6049130A Semiconductor device using gold bumps and copper leads as bonding
elements
失效
使用金凸块和铜引线作为结合元件的半导体器件
- 专利标题： Semiconductor device using gold bumps and copper leads as bonding elements
- 专利标题（中）： 使用金凸块和铜引线作为结合元件的半导体器件
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申请号： US853475申请日： 1997-05-09
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公开(公告)号： US6049130A公开(公告)日： 2000-04-11
- 发明人: Eiichi Hosomi , Hiroshi Tazawa , Chiaki Takubo , Koji Shibasaki
- 申请人： Eiichi Hosomi , Hiroshi Tazawa , Chiaki Takubo , Koji Shibasaki
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX7-35959 19950201; JPX7-346405 19951212
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/603 ; H01L23/495 ; H01L23/50 ; H01L23/48 ; H01L23/52
摘要：
A semiconductor device comprises a semiconductor chip, an Au bump formed on the semiconductor chip, and Cu lead bonded to the Au bump through a bonding part. The Cu lead has a Cu core and a plated Sn layer formed on the Cu core, and the bonding part is formed of an Au-rich Au--Cu--Sn alloy of a ternary system having a single-phase structure containing 15 at. % or less Sn and 25 at. % or less Cu.
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