发明授权
US6051815A Apparatus for heat-treating substrate and method for separating the
substrate from the apparatus
有权
用于热处理基板的设备和用于从该设备分离基板的方法
- 专利标题： Apparatus for heat-treating substrate and method for separating the substrate from the apparatus
- 专利标题（中）： 用于热处理基板的设备和用于从该设备分离基板的方法
-
申请号： US262340申请日： 1999-03-04
-
公开(公告)号： US6051815A公开(公告)日： 2000-04-18
- 发明人: Yasuyuki Satou
- 申请人： Yasuyuki Satou
- 申请人地址： JPX Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX10-053243 19980305
- 主分类号： H01L21/22
- IPC分类号： H01L21/22 ; H01L21/205 ; H01L21/687 ; H05B3/68 ; C23C16/00
摘要：
In the apparatus for and the method of heat-treating a substrate, the substrate is prevented from bearing any electrostatic charges without fail. A workpiece-carrying platform for carrying the substrate thereon is divided into: a workpiece-carrying platform body forming a major part of the workpiece-carrying platform; and, a lifting/lowering ring plate forming the remaining part of the workpiece-carrying platform. The lifting/lowering ring plate is received in a receiving groove of the workpiece-carrying platform body so as to be capable of being lifted and lowered therein. When the substrate is separated from the workpiece-carrying platform, the lifting/lowering ring plate is first lowered, and then the substrate is lifted by lift pins so that the substrate is lifted in two steps, whereby the contact surface of the substrate with workpiece-carrying platform is separated from the latter stepwise.
公开/授权文献
- US5457022A Silver halide photographic material 公开/授权日：1995-10-10
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