发明授权
US6052623A Feedthrough assembly for implantable medical devices and methods for
providing same
有权
用于可植入医疗器械的馈通组件及其提供方法
- 专利标题: Feedthrough assembly for implantable medical devices and methods for providing same
- 专利标题(中): 用于可植入医疗器械的馈通组件及其提供方法
-
申请号: US201059申请日: 1998-11-30
-
公开(公告)号: US6052623A公开(公告)日: 2000-04-18
- 发明人: Andreas A. Fenner , Lary R. Larson , Daniel R. Greeninger , David L. Thompson
- 申请人: Andreas A. Fenner , Lary R. Larson , Daniel R. Greeninger , David L. Thompson
- 申请人地址: MN Minneapolis
- 专利权人: Medtronic, Inc.
- 当前专利权人: Medtronic, Inc.
- 当前专利权人地址: MN Minneapolis
- 主分类号: A61N1/375
- IPC分类号: A61N1/375
摘要:
A feedthrough assembly for an implantable medical device includes one or more electrically conductive pins extending through apertures in a case of the medical device with the electrically conductive pins being insulated from the case. The feedthrough assembly further includes a printed circuit board having a diode protection circuit mounted thereon. The printed circuit board forms at least a part of electrically conductive paths for connection of the electrically conductive pins to a medical device circuit assembly mounted within the case. The printed circuit board further provides for electrical connection of the diode protection circuit mounted thereon between the electrically conductive pins and the case.
公开/授权文献
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