A method of manufacturing an electrostatic writing head automatically bonds conductors that form the writing electrodes of the head to a head member in a spaced parallel relationship according to the desired pitch of the writing head. The writing head includes a set of first surface conductive pads permanently fixed to a first surface of the first head member and disposed in a lengthwise row, and a set of second surface conductive pads permanently fixed to the second surface of the first head member. Each second surface conductive pad is paired with one of the first surface conductive pads, and the pair of pads is electrically connected by way of a conductive via extending through the first head member. The conductors are automatically bonded at one end to a respective one of the first surface conductive pads. The other end of each conductor is bonded to a bonding area that is later removed by cutting, thereby exposing the tips of the conductors in at least one line to produce the nib line of the head. The conductive pads may be arranged in a variety of novel arrangements that provide great flexibility in design in order to accommodate a wide variety of writing head pitches and lengths. The automatic bonding process is under processor control and is able to bond conductors according to a repetitive pattern consistent with a specific arrangement of the conductive pads.