公开(公告)号：US6056453A

公开(公告)日：2000-05-02

申请号：US770309

申请日：1996-12-20

Applicant: James R. Hufman ,  Joseph A. Chizuk, Jr. ,  George W. Davis ,  Charles F. Hurst ,  Derrick Arnold Kendrick ,  Michael A. Sprauve ,  Kenneth R. Chew

Inventor： James R. Hufman ,  Joseph A. Chizuk, Jr. ,  George W. Davis ,  Charles F. Hurst ,  Derrick Arnold Kendrick ,  Michael A. Sprauve ,  Kenneth R. Chew

IPC: B41J2/395 ,  B41J2/39 ,  B41J2/40

CPC classification number: B41J2/395

Abstract: A method of manufacturing an electrostatic writing head automatically bonds conductors that form the writing electrodes of the head to a head member in a spaced parallel relationship according to the desired pitch of the writing head. The writing head includes a set of first surface conductive pads permanently fixed to a first surface of the first head member and disposed in a lengthwise row, and a set of second surface conductive pads permanently fixed to the second surface of the first head member. Each second surface conductive pad is paired with one of the first surface conductive pads, and the pair of pads is electrically connected by way of a conductive via extending through the first head member. The conductors are automatically bonded at one end to a respective one of the first surface conductive pads. The other end of each conductor is bonded to a bonding area that is later removed by cutting, thereby exposing the tips of the conductors in at least one line to produce the nib line of the head. The conductive pads may be arranged in a variety of novel arrangements that provide great flexibility in design in order to accommodate a wide variety of writing head pitches and lengths. The automatic bonding process is under processor control and is able to bond conductors according to a repetitive pattern consistent with a specific arrangement of the conductive pads.

Abstract translation: 制造静电写头的方法根据写头的期望间距自动地将形成头部的书写电极的导体以间隔平行的关系自动地接合到头部构件。 写头包括永久地固定到第一头部构件的第一表面并且设置在纵向列中的一组第一表面导电垫，以及永久地固定到第一头部构件的第二表面的一组第二表面导电垫。 每个第二表面导电焊盘与第一表面导电焊盘中的一个配对，并且该对焊盘通过延伸穿过第一头部构件的导电通孔电连接。 所述导体的一端自动地结合到所述第一表面导电焊盘中的相应一个。 每个导体的另一端结合到随后通过切割去除的接合区域，从而将导体的尖端暴露在至少一条线中以产生头部的笔尖线。 导电垫可以布置成各种新颖的布置，其在设计中提供很大的灵活性，以便适应各种各样的书写头距离和长度。 自动接合过程处于处理器控制下，并且能够根据与导电焊盘的特定布置一致的重复图案来粘合导体。