发明授权
- 专利标题： Conductive particle transferring method
- 专利标题（中）： 导电粒子转移法
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申请号： US929057申请日： 1997-09-15
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公开(公告)号： US6063701A公开(公告)日： 2000-05-16
- 发明人: Satoshi Kuwazaki , Kazushi Iwata , Yoshihiro Yoshida , Tsutomu Sakatsu , Toshiaki Iwafuchi
- 申请人： Satoshi Kuwazaki , Kazushi Iwata , Yoshihiro Yoshida , Tsutomu Sakatsu , Toshiaki Iwafuchi
- 申请人地址： JPX Tokyo
- 专利权人： Ricoh Company, Ltd.
- 当前专利权人： Ricoh Company, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX8-265627 19960914; JPX8-312838 19961108
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H05K3/34 ; H01L21/283
摘要：
A process for manufacturing a device for arranging conductive particles in a preselected pattern for the connection of electric circuit boards or electric parts is disclosed. Particularly, a device capable of surely and efficiently transferring, e.g., solder bumps to the electrode pads of a semiconductor chip or the leads of a TAB (Tape Automated Bonding) tape and a conductive particle transferring method using the same are disclosed.
公开/授权文献
- US4823295A High speed signal processor 公开/授权日：1989-04-18
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