Invention Grant
- Patent Title: Method and apparatus for splicing and feeding slivers
- Patent Title (中): 用于拼接和喂纱的方法和装置
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Application No.: US148628Application Date: 1998-09-04
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Publication No.: US6065191APublication Date: 2000-05-23
- Inventor: Martin Leifeld
- Applicant: Martin Leifeld
- Applicant Address: DEX Monchengladbach
- Assignee: Trutzschler GmbH & Co. KG
- Current Assignee: Trutzschler GmbH & Co. KG
- Current Assignee Address: DEX Monchengladbach
- Priority: DEX19739186 19970908
- Main IPC: D01G27/00
- IPC: D01G27/00 ; B65H69/00 ; D01G19/08 ; D01H9/00 ; D01H15/00 ; D04H11/00
Abstract:
An apparatus for splicing a leading end of a first sliver deposited in a coiler can and a trailing end of an out-running second sliver fed into a fiber processing machine, includes a device for tapering the leading and trailing ends to obtain gradually tapered length portions thereof; a device for positioning the tapered length portions side by side to obtain a juxtapositioned relationship thereof; a pressure-applying constriction through which the first and second slivers pass for splicing together the leading and trailing ends by pressure; and a device for introducing the first sliver, spliced to the second sliver, into the fiber processing machine.
Public/Granted literature
- US5372954A Method of fabricating an insulated gate bipolar transistor Public/Granted day:1994-12-13
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